-
E-mail
frank.yang@acuitik.com
-
Phone
13817395811
-
Address
4th Floor, No. 298 Xiangke Road, Pudong New Area, Shanghai
Product Categories
Suzhou Xishi Technology Co., Ltd
Xishi Technology White Light Interference Film Thickness Gauge
NegotiableUpdate on 02/09
- Model
- Nature of the Manufacturer
- Producers
- Product Category
- Place of Origin
Overview
NS-30UV is a domestically produced white light interference film thickness measuring instrument produced by Suzhou Xishi Technology Co., Ltd. It can replace the KLA white light interference film thickness measuring instrument and use optical interference principle to achieve non-contact measurement of nanometer to micrometer level thin film thickness.
Product Details
The NS-30UV thin film thickness gauge is a domestically produced white light interference film thickness measuring instrument produced by Suzhou Xishi Technology Co., Ltd. It uses the principle of optical interference to achieve non-contact measurement of film thickness at the nanometer to micrometer level.
1、 Technical parameters:
1. NS-30UV Core Parameters
-Wavelength range: 190-1700 nm
-Measurement range: 1 nm -250 μ m
-Measurement accuracy: 1 nm or 0.2%
-Repetition accuracy: 0.02 nm
-Measurement time: less than 1 second
-Stability: 0.05 nm
-Spot size: 0.5 mm
2. Same series model specifications
2、 Working principle
The NS-30 uses the optical interference principle of vertically incident high stability wideband light to measure the thickness, reflectivity, and refractive index of transparent or semi transparent film layers at the nanometer to micrometer level. The vertically incident high stability wideband light is incident on the surface of the sample, causing optical interference between the various film layers. The reflected light can be analyzed by spectroscopy and regression algorithms to calculate the thickness of each layer of the film.
3、 Product Features
1. Core advantages:
-Localization of software and hardware: 100% domestically developed, 100% independently controllable
-Non contact measurement: capable of measuring hard materials, soft materials, or samples with easily damaged surfaces
-High precision and high stability: sub nanometer thickness measurement accuracy, static stability up to 0.02 nanometers
-Multi layer film measurement capability: capable of measuring the thickness of each layer in multi-layer composite films
-Intelligent algorithm: core algorithm, one click measurement of large-span film thickness
2. Functional features:
-Sample automatic measurement, platform size 100mm~450mm optional
-The software automatically generates the distribution of measurement points according to the requirements
-2D and 3D mapping effects, including information such as thickness, refractive index, and reflectivity
-Measurable film stress and surface bending (Stress/Bow)
-Measurement speed: 5 points -5 seconds (200mm wafer), 25 points -14 seconds
Display of actual test results
4、 Application Fields
1. The NS-30 thin film thickness gauge is widely used in multiple high-tech fields:
-Semiconductor manufacturing: measurement of deposition/etching film thickness, surface flatness detection in CMP process, analysis of resist step height
-Photovoltaic and display panels: solar coating film thickness, AMOLED screen microstructure, touch panel copper trace measurement
-Optical coating: Measurement of film thickness for optical components such as AR anti reflection layer, AG anti glare coating, filter, glasses, etc
-Electronics and Materials Science: Measurement of Thin Film Thickness for Semiconductor Chips, Liquid Crystal Display Screens, and Analysis of Material Surface Stress
-Biomedical: Thickness detection of thin film materials such as Parylene, polymers, biofilms, medical devices, etc
2. Maintenance and upkeep:
-Keep the machine clean and cover it with dust-proof cloth during non test time
-Avoid electromagnetic field interference during instrument operation
-Regular calibration and maintenance
The NS-30 series, as a desktop automatic film thickness measurement and analysis system, superimposes an automatic sample stage on the basis of film thickness measurement, which can automatically measure the set points and further generate 2D and 3D data distribution maps. It is particularly suitable for precision application scenarios such as wafer film thickness measurement.
Similar Product Recommend
