Wafer Surface Particle Rapid Detection System (PDS)

FastmicroWafer Surface Particle Rapid Detection System (PDS)

FastmicroWafer Surface Particle Rapid Detection System (PDS)Specially designed for direct measurement of surface particle pollutants in various industries, it is mainly used for wafer, film, and photomask detection in the semiconductor field, and can also be used for substrate detection in the display market. The system is equipped with a 4-12 inch field of view (FOV) scanning area and supports upper and lower surface detection. Its optical design allows the product to be tested without moving during the measurement process. The system can be customized according to different production process requirements or directly integrated into the production line.

Consistency measurement during the production process

Quick:Capable of completing large-area imaging within seconds

Quantitative:Validation and monitoring applicable to production and research and development environments

Easy to operate:Unaffected by operators, automated, clean gripping method

Accurate:High resolution measurement (quantity, position, size)

uniformity:Maintain objectivity and stability in every measurement

High throughput:Can obtain results within the process time window

FM-PDS: Direct detection of surface particles

This system can be used for wafer manufacturing processes, next-generation compound semiconductors, and excellent packaging applicationsProvide high-throughput surface particle contamination detection services.

This system is suitable for particle sizes greater than 0.1&μmThe particles have high sensitivity and are a type of high-sensitivityEfficient and service-oriented choices.

It can be operated manually or automatically, andLower maintenance costs, replacing traditional particle detection systems.

For the next generation of semiconductor production applications, the PDS system has the following attributes: double-sided identicalTime scanning (optional);

Static field of view scanning (without moving the product during image acquisition).

Multi functional modular platform

The system can be customized to adapt to each production certification process or integrated into the production line. Its configurationIncluding manual or automatic wafer gripping mobile devices, packaging opening for inspection and cleaningEquipment, filling equipment, robotic arm, detection unit, and cleaning equipment.

The system can be customized and expanded according to customer needs. The measurement module can also be a systemIntegrated integrators and original equipment manufacturers (OEMs) provide OEM services.