Plasma enhanced chemical vapor deposition (PECVD) system

1. Flexible sedimentation ability

·Silicon based deposition process-Oxide, nitride, oxynitride, amorphous silicon（a-Si）、Silicon carbide（SiC）

·Research and Development

·prototyping

·Small batch production-PhotonicsSolid state lightingTheMEMSAnd nanotechnology

·Application areas: interlayer insulation layer, passivation layer, encapsulation layer, mask layer, anti reflection layer

2. Performance value

1. Large manual loading platform(406mm)

2. Excellent cleanliness

3. Highuniformity

4.High throughput

5. Reliable software

6.Compact footprint

7.Cost effective

8.easy to maintain

9.Adopting industry-leading components

3. Verified solutions

·Continued itPTI 790/790+The design concept

oManual loading, no load lock required (supports batch or single wafer)

oInstalled more than400Set system

oSimple technology and sturdy structure Competitive price and reliable quality

Compact footprint, saving space