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E-mail
marketing@dymek.com
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Phone
13917837832
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Address
Room 306-308, Building 6, No. 35, Lane 2216, Jingao Road, Pudong, Shanghai
Product Categories
Daimei Instrument Technology Service (Shanghai) Co., Ltd
Laser microfabrication
NegotiableUpdate on 12/23
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Overview
The high-precision laser trimming $r $nmicroVEGA FC system for wire cutting on semiconductor chips can perform high-throughput laser microfabrication for different applications in the semiconductor industry. This system combines high-precision technology with high dynamic performance. Therefore, its possible applications include: programming of $r $n digital logic circuits, trimming of $r $n digital potentiometers, repair of semiconductor memory on $r $n chips, and removal of $r $n failed micro LEDs.
Product Details
High precision laser trimming for connecting wire cutting on semiconductor chips
The microVEGA FC system can perform high-throughput for different applications in the semiconductor industryLaser microfabricationThis system combines high-precision craftsmanship with high dynamic performance. Therefore, its possible applications include:
Programming of digital logic circuits,
The adjustment of digital potentiometers,
Repair of semiconductor memory on chips,
Removal of failed micro LEDs.
Thanks to its highly flexible tool configuration, microVEGA FC is capable of processing 200mm and 300mm wafers with processing speeds of up to 400mm/s, making it an ideal production solution in terms of cost, yield, yield, and sensitivity.
The microVEGA FC uses a micro level single digit laser spot to continuously move on the semiconductor wafer. During this process, the laser selectively processes specific microstructures at high speed. Due to the small size of these structures (about 1-2 microns), it is required that the laser spot has a high relative to these structuresThe three-dimensional positioning accuracy. For this purpose, microVEGA FC is equipped with integrated measurement technology to achieve 100% process control.
