Plasma enhanced chemical vapor deposition (PECVD) system

1. Flexible sedimentation ability

·Silicon based deposition processes - oxides, nitrides, oxynitrides, amorphous silicon（a-Si）、Silicon carbide（SiC）

·Research and Development

·prototyping

·Small batch production-Photonics, solid-state lightingTheMEMSAnd nanotechnology

·Application areas: interlayer insulation layer, passivation layer, encapsulation layer, mask layer, anti reflection layer

2. Performance value

1. Large manual loading platform(406mm)

2. Excellent cleanliness

3. High uniformity

4. High throughput

5. Reliable software

6. Compact footprint

7. Cost effective

8.easy to maintain

9.Adopting industry-leading components

3. Verified solutions

·Extensive 'turnkey' craftsmanship

·High film uniformity achieved through optimized spray heads

·High standard utilization and reliability - using Tier I OEM components, rapid vacuuming, and optional in-situ endpoint detection to avoid excessive cleaning

·Enjoy recognized services and support

·Stress control achieved through low-frequency or helium dilution