Capacitive displacement sensor probe

What is a capacitive sensor?

A capacitive sensor is a device that works by measuring linear displacement between two parallel plates, where one plate is the sensor itself and the other plate is the object measured by the sensor - the target object.

A typical capacitive sensing system

-A capacitive probe, also known as a "sensor probe," is a metal or ceramic casing containing a capacitive sensor for detecting target objects.
-The measurement module, also known as the "measurement circuit board", contains driving electronic components for sensors and provides analog output signals for the sensors.
-The analog signal output from the measurement circuit board is usually connected to the A/D (Analog to Digital) conversion card in the customer's computer.

Sensor construction

If there is no shielding ring (protective electrode), the electric field lines may extend beyond the sensor and interact with other grounded surfaces or electric fields. By driving the electric field of the shielding ring in phase with the sensor, the sensor can only form an electric field with the desired target.

Active and passive capacitive sensors

-Passive sensors are suitable for most application scenarios. Its probe does not contain driving electronic components inside, thus it has excellent stability and linearity.

-Active sensors contain special drive circuits within the probe, designed specifically for "high dynamic" applications that require high resolution and high measurement bandwidth.

Passive capacitive probe

Active capacitive probe

Customized probe

The probe can be customized in various ways
-Customize probe size or shape according to customer needs
-Front end of probe with inclined cutting
-Probe with through-hole installation instead of clamp installation
-High stability option - can be used in conjunction with the 4810 high stability measuring instrument option

Special purpose probe

-Ceramic probes are suitable for high stability applications
-Invar alloy can be used in passive probe design to improve thermal stability
-Provide probe options that can be compensated for poor wafer grounding in application scenarios