Laser annealing

High speed ultraviolet for forming ohmic contactsLaser annealingThe microPRO XS OCF system provides a multifunctional platform that enables high repeatability and throughputLaser annealingThe system combines stable laser optical modules with 3D Micromac's modular processing platform, making it highly suitable for Ohmic Contact Formation (OCF) in Silicon Carbide (SiC) power devices.

The microPRO XS OCF uses a diode pumped solid-state (DPSS) laser source with ultraviolet wavelength, which has nanosecond pulse and spot scanning functions, and can process the entire metalized backside of SiC wafers. *The process procedure and optimized chamber layout have reduced the generation of particulate matter. The individually adjustable laser spot profile enables the system to process wafers with different material compositions.

Main Features

• Industry leading throughput (up to 22 WPH/6-inch wafer)

• Excellent uniformity of block resistance (Rs) (δ<1.1%)

• Support seamless splicing of 6-inch and 8-inch wafers - no need to replace equipment

• Capable of processing ultra-thin wafers

• compact footprint

• Automated beam stabilization function

Optional configuration

• Supports 6-inch and 8-inch wafer processing

• Automatic ultra-thin wafer handling and pre alignment function for production applications

• SECS/GEM interface