EVG Instrument Automatic Mask Alignment System

IQ Aligner NTAutomatic Mask Alignment SystemIt is a non-contact lithography platform with a high degree of automation, which can meet the needs of minimizing mask contamination in the production line and improving mask life and product yield. In addition to various alignment functions, the system has undergone extensive installation and on-site verification through specialized configuration, and can automatically support and handle warped or thinned wafers. The mixed matching operation between standard top or bottom alignment and integrated IR alignment function further expands the application field, especially when aligning with engineering or bonding substrates. The system also supports wafer alignment runout control through a rapid response temperature control toolkit.Compared with EVG's previous generation IQ Aligner, the illumination intensity of high-power optical devices has increased by three times, making it an ideal choice for exposing thick resist and other films related to processing bumps, pillars, and other high morphology features.

IQ Aligner Performance Characteristics

• Zero auxiliary bridging tool - dual substrate, supporting 200mm and 300mm specifications

• Fully Transparent Field Mask Movement (FCMM) enables flexible pattern positioning and compatibility with dark field mask alignment
  

• Unparalleled throughput (first printing/alignment)>200 wph/160 wph

• The top/bottom alignment accuracy reaches ± 250 nm/± 500 nm

• ■ 100% contactless approach process

• ■ Dark field alignment ability/Full Field Clear Mask (FCMM)

• Accurate bounce compensation to achievesmallGood overlapping alignment

• Intelligent process control and performance analysis framework software platform

Technical data

Wedge compensation: fully automatic - software control; non-contact

Advanced alignment function: automatic alignment; Large gap alignment; Jump control alignment; dynamic alignment

Industrial automation functions: cassette tape/SMIF/FOUP/SECS/GEM/thin, curved, warped, edge wafer processing

Wafer diameter (substrate size): up to 300 millimeters

Alignment method:

• Upper alignment: ≤± 0.25 µ m

• Bottom alignment: ≤± 0.5 µ m

• Infrared calibration: ≤± 2.0 µ m/depending on the substrate

Exposure settings: vacuum contact/hard contact/soft contact/proximity mode/bending mode

Exposure options: Interval exposure/Whole film exposure

System control:

• Operating System: Windows

• File sharing and backup solutions/unlimited formulas and parameters

• Multi language user GUI and support: CN, DE, FR, IT, JP, KR

• Real time remote access, diagnosis, and troubleshooting

application

IQ Aligner NT is highly suitable for various advanced packaging types, including wafer level chip level packaging (WLCSP), fan out wafer level packaging (FOWLP), 3D-IC/through silicon via (TSV), 2.5D interlayer, and flip chip.