MOCON supports the 5th China Youth Packaging Innovation and Development Forum

On August 17-18, 2023, the 5th China Youth Packaging Innovation and Development Forum (PDF-2023) will be held at the Shanghai Hongqiao Xijiao Manor Hotel.

The theme of this conference is "Promoting Sustainable Development and Innovation of Packaging under the Background of Dual Carbon". According to the organizer, this forum will gather middle and senior level managers from various packaging industry chains to explore packaging innovation, sustainable packaging, and the development trends of the packaging industry, promoting in-depth communication and resource optimization between the upstream and downstream of the packaging industry.