09,11,2026 7 views
The 27th China International Optoelectronics Expo (CIOE) was successfully held from September 9-11, 2026 at the Shenzhen International Convention and Exhibition Center. As a comprehensive exhibition covering the entire optoelectronic industry chain, the CIOE China Optoelectronics Expo brings together over 4000 high-quality exhibitors from more than 30 countries and regions around the world. The eight themed exhibitions cover information communication, precision optics, camera technology and applications, laser and intelligent manufacturing, infrared, ultraviolet, intelligent sensing, new displays AR & VR、 The Optoelectronic Innovation and other sectors showcase industry innovation achievements and cutting-edge technologies. Shenzhen Kejing Zhida Technology Co., Ltd. was also invited to participate in this grand event.
Shenzhen Kejing Zhida Technology Co., Ltd. (hereinafter referred to as Shenzhen Kejing) was established in 2001. It is an enterprise serving the optical communication and optics industry, focusing on the production and sales of high-end shaped, high-precision, high-value component storage, transportation, and special packaging products.
In the early days of its establishment, Shenzhen Kejing mainly provided packaging products for clean storage and secure transfer of semiconductors and precision optical devices. After more than 20 years of development and accumulation, Shenzhen Kejing has become a comprehensive solution provider for materials and new energy basic research, small and medium scale testing, testing and evaluation.
From component packaging such as self-adhesive adhesive boxes, high elasticity film boxes, silicon wafer series, vacuum suction pens, and multifunctional tweezers series, to further deepening the introduction of sintering furnace equipment series and cutting and polishing equipment series at the crystal raw material end, a one-stop product service system. Nowadays, the product applications of Shenzhen Kejing have covered new energy materials, nanomaterials, lithium-ion batteries, sodium ion batteries, fuel cells, solid-state batteries, perovskite solar cells, supercapacitors, and functional thin films. At the CIOE event, Shenzhen Kejing brought its SmarPAK optoelectronic packaging products, attracting numerous professional visitors and business representatives to the booth to discuss cooperation.
SmarPAK photoelectric packaging products are popular products under Shenzhen Kejing, covering multiple series such as self adsorption adhesive boxes, high elasticity film boxes, sponge boxes, crystal round boxes, vacuum adsorption boxes, etc., which can meet the packaging needs of different users.
(Image source: Shenzhen Kejing Zhida Technology Co., Ltd.)
The SP1 series self adsorption plastic box has the characteristics of high polymer adhesive layer. The loaded device can be safely adsorbed without foam, sponge and other filling materials. It can also ensure that the device will not be damaged during storage, transportation and material flow on the production line. At the same time, the shape and size of the product have a wide range of adaptability, enabling touchless packaging, storage, and transportation of devices with special surfaces, meeting the special packaging needs of some fragile and surface quality demanding devices. In addition, the high cleanliness of the adhesive layer surface ensures that the device will not be contaminated by dust; The high transparency adhesive layer and packaging box body can achieve non opening inspection for some devices with special requirements.
The SP2 series built-in tray self-adhesive rubber box is an upgraded version of the original SP1 self-adhesive rubber box by adding trays to meet the testing needs of automated machines. The tray inside the box can be removed for inspection, suitable for the needs of small components such as chips.
The SP3 series high elasticity membrane box adopts an elastic membrane structure, and its excellent shock absorption performance can adapt to harsh transportation conditions. It is suitable for various precision, high-value, and fragile devices, especially those with irregular shapes.
SmarPAK Optoelectronic Packaging Products (SP1, SP2, SP3 from left to right)
SP4 series EVA and sponge boxes are made from compounding Pe and carbon, and are horizontally coupled with radiation and foam. They have excellent conductivity and can permanently eliminate static electricity. At the same time, the unique and precise honeycomb structure of the product can effectively prevent damage to the device caused by shaking and vibration. The characteristics of the material itself, such as corrosion resistance, anti detachment, and low puncture force, can also ensure that fragile and precise components can be safely, cleanly, and easily placed inside. Suitable for packaging products such as crystals, optoelectronic devices, glass, ICs, PCBs, etc.
The SP5 series of silicon wafers and wafer boxes includes multiple different products, among which SP5-S1, SP5-S2, SP5-S3, SP5-S4, SP5-S5, SP5-S6, SP5-S25, and SP5-S15 include boxes, lids, and inner flower elastic fixing plates. The inner flower elastic plate design has the function of fixing the product, which can effectively ensure the safety of samples during transportation or storage; SP5-170 is easy to clean and assemble, and the same wafer box can simultaneously accommodate one 4/5/6 inch wafer; SP5-2-25, SP5-3-25, and SP5-4-25 can each store 2/3/4 inch wafers. One chip box can hold up to 25 wafers and ensure the safety and cleanliness of wafer transportation and retrieval.
SmarPAK optoelectronic packaging products (left and middle images show SP4 series, right images show SP5-2-25, SP5-3-25)
The SP6 series vacuum adsorption box adopts a special polymer film, Tray+film structure, and transparent colloid. Under normal conditions, the adhesive surface components are tightly adhered to ensure that the components do not move during transportation and turnover. The surface adhesion is reduced under vacuum conditions, making it easy to remove the product. The vacuum box technology depends on the special storage and transportation of products suitable for a series of high-tech fields such as optical materials, semiconductor components, optical devices, medical equipment, etc. The use of vacuum technology for regulation and control can effectively improve the efficiency of workpieces and components in automated and semi automated production.
The SP7 series expansion ring and chip ring are made of brand new PET material, and the structure adopts professional standardized card slots, which have the advantages of easy disassembly and assembly, anti-static, shock and pressure resistance, and stable and tight box cover. The unique structure ensures the safety and cleanliness of the product during transportation and retrieval.
Since its establishment, Shenzhen Kejing has always adhered to the principle of "product first, customer first", and wholeheartedly serves consumers with a "focused, dedicated, and dedicated" attitude. And with enthusiasm and continuous innovation, we solve the packaging needs of domestic customers in the optoelectronic industry and provide high-precision and cutting-edge preparation for the basic research of raw materials in the optoelectronic field. Next, Shenzhen Kejing will continue to forge ahead, accelerate the transformation of innovative achievements to better serve the development of the optoelectronic industry, and bring more and better products to consumers.
