Wavelength dispersive X-ray fluorescence spectrometer

Wavelength dispersive X-ray fluorescence spectrometer WDA-3650Used for thin film evaluation, while conducting non-destructive and non-contact analysis of the thickness and composition of various thin films.

This is a wavelength dispersive X-ray fluorescence spectrometer (WD-XRF) that can simultaneously analyze the thickness and composition of various thin films on wafers up to 200mm in size in a non-destructive and non-contact manner. The XY θ Z driven sample stage (method) can accurately analyze various metal films and avoid the influence of diffraction rays. A 4kW high-power X-ray tube can achieve high-precision analysis of ultra light elements, such as trace element measurement and boron analysis of BPSG thin films. It also supports C-to-C transport robots (optional). It is equipped with automatic calibration (fully automatic daily check and intensity correction function).

◆ Support concentration and composition analysis of trace elements

Suitable for various elements from light to heavy: 4 is~92U

◆High sensitivity boron detector AD boron

We are constantly developing new optical systems, such as improving boron analysis capabilities, to enhance the accuracy and stability of analysis. In addition, the cooling mechanism and vacuum stabilization mechanism are stable standard equipment.

◆X-Y - θ driver stage

The X-Y - θ driven sample stage and measurement direction setting program can accurately measure the thickness and composition distribution of thin films on the entire wafer. Ferroelectric thin films are also not affected by diffracted beams.

◆Application:

・Semiconductor device BPSG, SiO2 tetra3N4

Doped polycrystalline silicon (B, P, N, AS), Ws ix

・ Al-Cu，TiW，TiN、TaN，PZT，BST，SBT

・MRAM

・金属膜 W，Mo，Ti，Co，Ni，Al，Cu，Ir，Pt，Ru

・磁盘 CoCrTa，CoCrPt，DLC

・NiP

Magneto optical disc Tb FeCo

Magnetic head GMR, TMR

◆Wide range of fixed angle measuring instrument product lineup

We provide the most suitable fixed angle measuring instrument based on membrane thickness and membrane structure. We are still preparing a dedicated optical system that can analyze the Ws ix thin film on silicon wafers.

◆Fully automatic daily management function with automatic calibration

In order to obtain accurate analytical values, it is necessary to calibrate the instrument correctly. For this purpose, it is necessary to regularly measure and inspect wafers and adjust wafers with PHA as management wafers to maintain the health of the equipment. This routine calibration work is automated, reducing the workload of operators. This is the AutoCal feature.

◆Compatible with C-to-C automatic conveying

In addition to the open cassette, it also supports SMIF POD. Compatible with wafers below 200mm. In addition, it can also communicate with the host through SECS and support various CIM/FA formats.

◆Compact energy-saving design

The compact design of the host occupies an area of less than 1m2. The use of oil-free transformers also makes auxiliary equipment more compact and energy-efficient in design.

• Simultaneously evaluate film thickness and composition

• Suitable for all types of films

• Supports wafers and media disks smaller than 200mm

• High analytical performance, accuracy, and stability

• The XY θ Z driven sample stage obtained can obtain accurate XRF results

• High sensitivity boron analysis (with AD boron channel)

• Use the optional C to C auto loader for automatic calibration

• Oil free Transformer X-ray Generator

• Power consumption is 23% lower than previous models

Product Specifications