Research type plasma dry etching (ICP/CCP) system

PLUTO-E100 typeResearch type plasma dry etching (ICP/CCP) systemIt is a low-cost desktop research equipment suitable for research institutions and laboratories. The purpose of the entire system is to perform dry etching on samples of 4 inches and below. The system includes several subsystems such as reaction chamber, vacuum system, RF radio frequency system, reaction gas path system, electrical control, software program, etc.

The entire system is controlled by fully automated software, supports recipe writing, and has the ability to automatically run multiple process steps. The equipment is equipped with safety protection functions such as interlock, power-off memory, automatic alarm, and molecular pump protection. To ensure the flexibility of the equipment, reserve a certain amount of upgrade space.

Research type plasma dry etching (ICP/CCP) systemTechnical Specifications:

1. Reaction chamber: T6060 aluminum alloy, suitable for samples of 4 inches and below;

2. The vacuum system consists of a molecular pump and a mechanical pump, and the vacuum measurement system uses a capacitive pressure gauge;

3. The equipment is equipped with a 1000W 13.56MHz RF power supply, an automatic RF matching device, RF cables, and dedicated RF connectors;

4. Equipped with 4 reaction gases, it can be upgraded up to 6 channels at most;

The entire system of ICP plasma etching machine is an automated control system, which is jointly implemented through PLC, industrial computer, and control software.

Research type plasma dry etching (ICP/CCP) systemApplication fields:

Microelectronics manufacturing: Plasma etching is widely used in integrated circuit and chip manufacturing to create fine structures in circuits, such as transistors, capacitors, etc., as well as to repair or adjust electronic devices on chips.

Optical device manufacturing: Plasma etching technology can be used to manufacture optical devices such as optical fibers, optical waveguides, etc. By controlling the energy and density of the plasma, the desired structure and shape can be formed on optical materials.

MEMS manufacturing: Plasma etching machines can be used to manufacture fine structures and devices in microelectromechanical systems (MEMS), such as microsensors, wireless communication devices, and micro mechanical motion systems.

Mask manufacturing: Plasma etching is used to create patterns on masks, as well as to repair or modify fine structures on masks.

Biomedical applications: Plasma etching can be used in the biomedical field, such as the manufacturing of microfluidic chips, biochips, etc., to achieve the preparation of microstructures for biological analysis and experiments.

Nanotechnology: Plasma etching can be used to manufacture nanomaterials and nanostructures, such as nanotubes, nanoparticles, etc. By controlling the composition and reaction conditions of the plasma, precise modification and control of the materials can be achieved.

Wafer manufacturing: During the wafer manufacturing process, plasma etching machines use carbon tetrafluoride gas for line etching of silicon wafers, as well as etching of silicon nitride and removal of photoresist. By adjusting the gas composition, the etching depth can be precisely controlled, achieving high-precision etching at the micrometer level.