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Shanghai Peiyuan Instrument Equipment Co., Ltd
ICP plasma etching machine
NegotiableUpdate on 01/14
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Overview
The ICP plasma etching machine WINETCH is a cost-effective ICP plasma system designed for the needs of scientific research and enterprise R&D customers. As a multifunctional system, it achieves high-performance ICP etching process through optimized system design and flexible configuration scheme. The device has a compact structure and small footprint. The professional mechanical design and optimized automation operation software make the operation of the device simple, safe, and the process stable with good repeatability.
Product Details
ICP dry etching is a common micro nano processing technique, which uses a high-frequency electric field to ionize gas, forming plasma, and then introducing the plasma into a reaction chamber to corrode or deposit materials through chemical reactions inside the reaction chamber. In ICP dry etching, the role of high-frequency electric field is to ionize gas molecules, forming electrons and ions. Ions accelerate under the action of an electric field and collide with gas molecules inside the reaction chamber, forming plasma. Plasma has the characteristics of high temperature and high energy, which can efficiently process materials. The characteristic of ICP dry etching is that it can achieve high-precision, high-speed, and high uniformity etching, and has minimal damage to the material. It is commonly used in fields such as microelectronic device manufacturing and optical device processing. However, it should be noted that when using ICP dry etching, appropriate parameters such as gas, power, and reaction chamber temperature should be selected to avoid negative effects on the material.
ICP plasma etching machine WINETCHIt is a cost-effective ICP plasma system designed for the needs of scientific research and enterprise R&D customers. As a multifunctional system, it achieves high-performance ICP etching process through optimized system design and flexible configuration scheme. The device has a compact structure and small footprint. The professional mechanical design and optimized automation operation software make the operation of the device simple, safe, and the process stable with good repeatability.
ICP plasma etching machine WINETCH product features：
4/6/8 inch compatible, single-chip wafer vacuum transfer system
Low cost and high reliability, suitable for research and development as well as small-scale production
The device has a simple structure and a small appearance
● Easy to operate, convenient for automatic control, suitable for large-area substrate etching
Excellent etching uniformity and fast etching rate
● Formula driven and management software control system that meets semiconductor standards
● High selectivity, high anisotropy, and minimal etching damage
High controllability of cross-sectional profile, smooth and even etched surface
ICP plasma etching machineTechnical Specifications:
Wafer size: 4/6/8 inches compatible
Applicable process: plasma etching
Applicable materials: SiC, Si, GaN, GaAs, InP, Ploy, etc
Applicable fields: compound semiconductors, MEMS、 Power devices, scientific research and other fields
