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Maikono Technology Co., Ltd
Pure tin electroplating solution
NegotiableUpdate on 05/06
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Overview
In the electronic manufacturing industry, the quality of tin plating directly affects the soldering performance and long-term reliability of products. TRANSENE Tin 100% pure tin plating solution, with its innovative fluoroborate formula and process stability, has become a global solution for electronic component manufacturing. This ready to use electroplating solution can provide a uniform and dense coating structure, significantly improving the welding performance and conductivity of the product.
Product Details
Revolutionary formula design
The TRANSENE Tin 100% electroplating solution uses a formula that includes:
lBasic System of Metal Fluoroborate
lSpecialized additive combination
lStabilizer system
lWetting agent technology
This chemical combination ensures:
✓ Extremely fine grain structure (grain size<5 μ m)
✓ Excellent coating uniformity (thickness deviation ± 8%)
✓ Weldability (certified by J-STD-002)
✓ Stable long-term storage performance
Optimized process parameters
key parameters |
technical indicators |
workPH value |
<0.5 (strong acidic system) |
temperature range |
21-38℃（70-100℉） |
current density |
25-30ASF (Ampere per square foot) |
working voltage |
2-4V |
Anode efficiency |
100% |
Anode cathode ratio |
2:1 |
sedimentation rate |
0.001 inches/17-20 minutes |
Key points of professional process control
1. temperature management：
lBest operating temperature38℃（100℉）
lEvery increase5 ℃, sedimentation rate increased by about 15%
2. current control：
lbelow25ASF will reduce the proportion of tin deposition
labove30ASF will increase the proportion of tin deposition
lAccurate control in25-30ASF can achieve the best results
3. mixing system：
lProhibit the use of air agitation (which can cause tin oxidation)
lRecommend using cathode rod mobile mild stirring
4. filtering requirements：
lAcid resistant filtration system must be used
lRecommended filter materials: polyester, nylon cloth or pulp
Widely applicable fields
This product is particularly suitable for:
✓ Surface treatment of printed circuit board (PCB)
✓ Electronic connector coating
✓ Semiconductor lead frame
✓ Precision wire electroplating
✓ Terminal processing of electronic components
Product advantages
1. Easy to operate：
lReady to use formula, no need for complex preparation
lWide process window, easy to control
2. cost-effective：
l100% anode efficiency, material utilization rate
lRapid sedimentation rate to improve production efficiency
3. ：
lCoating throughIPC-4552 standard certification
lWeldability retentionMore than 12 months
4. Device compatibility：
lCompatible with conventional electroplating equipment
lMaterial requirements for tank body:PVC、 Rubber, organic glass or polypropylene
choiceTRANSENE Tin 100% pure tin plating solution provides long-lasting and reliable surface protection for your electronic products!
