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Maikono Technology Co., Ltd
Acidic copper plating solution
NegotiableUpdate on 05/06
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Overview
In the fields of PCB manufacturing and precision electronics, the quality of copper plating directly determines the conductivity and reliability of products. Transene Copper Plating Acid Type has become the gold standard in the global electronics manufacturing industry due to its revolutionary formula design and process stability.
Product Details
Core technology breakthrough
TRANSENEAcidic copper plating solutionAdopting an innovative chemical system, it has three major technological advantages:
1. Intelligent stabilizer system：
lAccurately control the resistivity of the plating solution
lPromote the formation of bright and dense coatings
lEffectively inhibit dendritic growth
2. Nano scale grain control：
lObtain a uniformly distributed non columnar crystal structure
lThe grain size is controlled within50-100nm range
lsurface roughnessRa<0.2μm
3. Wide process window design：
lTemperature adaptation range21-49℃（70-120℉）
lCurrent density window20-50ASF
lCompatible with multiple substrate treatments
Process performance parameters
key metrics |
Technical specifications |
Operating Temperature |
21-49℃（70-120℉） |
Optimal current density |
20-50ASF |
Sedimentation rate（At 20ASF) |
0.5 mil/hour (12.7 μ m/h) |
Copper ion concentration |
6 ounces per gallon (45g/L) |
PH range |
2.5-3.5 |
Anode cathode ratio |
1:1 |
working voltage |
4-6V |
Professional application solutions
This product is particularly suitable for the following application scenarios:
✓ High density interconnect (HDI) PCB manufacturing
✓ Integrated circuit board electroplating
✓ Semiconductor package through-hole filling
✓ Precision connector surface treatment
✓ Heat dissipation layer for power electronic devices
Intelligent Process Control System
1. precisePH management：
lAdopting sulfuric acid automatic regulation system
lreal-time monitoringPH fluctuation ± 0.1
lEnsure process stability
2. Efficient filtration solution：
lContinuous filtration system
lRecommended filtering accuracy1-5μm
lCompatible with multiple acid resistant materials
3. Mixing technology：
lMechanical mixing design
lOptimize fluid dynamics parameters
lEnsure the uniformity of the plating solution
Core advantages of the product
1. Expert in through-hole electroplating：
lAdvanced plating ability（TP value>85%)
lCovering high aspect ratio structures
lAddressing traditional craftsmanshipThe 'Dog Bone' Effect
2. Significant economic benefits：
lIncreased sedimentation rate30%
lCopper anode100%利用率
lExtend the service life of plating solution
3.：
lthroughIPC-4552A certification
lCoating ductility>15%
lresistivity< 1.72. Mu. M cm
choiceTRANSENE acid copper plating solution provides superconducting grade copper coating protection for your electronic products! Let's work together to push electronic manufacturing processes to new heights.
