On August 22, 2025, Shanghai Botuo Instrument launched the IEC-DNPA digital induction conductivity sensor, which meets the monitoring needs of high salt wastewater in the chemical and thermal power industries. It uses PEEK/PFA material and seven point calibration technology to achieve wide range measurement from 0.5mS/cm to 2000mS/cm. This product offers 7 flexible installation methods, suitable for different pipeline scenarios,fill inThe technological gap of high-precision industrial conductivity sensors
Technical Highlights
Measurement performance: accuracy ± 2% reading or ± 1mS/cm (whichever is greater), temperature measurement accuracy ± 0.5 ℃
Material selection: Integrated/split type shell optional, temperature resistance range -30 ℃~150 ℃, pressure up to 2.1MPa
Communication function: RS485 interface, Modbus RTU protocol, supports remote parameter setting and calibration
Installation adaptation: 7 methods including flange, sleeve, clamp, etc., suitable for DN50~DN200 pipelines
Core strengths
Compared to traditional contact conductivity sensors, the innovation of IEC-DNPA lies in:
Improved corrosion resistancePEEK material has better acid and alkali corrosion resistance than 316L stainless steel, and its service life is extended by 2 times
Enhanced maintenance convenienceSupport online calibration (standard solution/five point calibration), the calibration process does not require disassembling the sensor
Data reliability assuranceThrough 1000 hours of salt spray testing, the stability error is less than ± 1% in high humidity coastal environments
Application Cases
This product has been widely applied in a chemical industrial park in Zhejiang Province, with the main benefits including:
The error between the conductivity monitoring data of the circulating water system and the laboratory comparison is less than ± 2%, which meets the requirements of process optimization
The average time between failures (MTBF) of the sensor reaches 18 months, which is 50% higher than traditional products
Reduce installation costs by 40% and shorten on-site debugging cycle to 2 hours per unit through modular design
