- Phone
-
Address
Room 707, Aiqian Building, 599 Lingling Road, Xuhui District, Shanghai, China
Product Categories
- Z-series stereomicroscope Leica Z6 APO
- F30 online film thickness tester
- F60 Fully Automatic Film Thickness Tester
- Diener NANO plasma cleaning machine
- Vista-IR High Resolution Nanoinfrared Imaging and Spectroscopy System
- LF-2000 Integrated In Situ Nanomanipulation Machine
- 6-inch nanoimprint machine NIL-150
- Passive isolation table GWA-TM
- High precision nano stretching system Nano UTM T150
- RSA5000 series spectrum analyzer
- TTR500 Series Vector Network Analyzer (VNA)
- MTA02 Micro Force Displacement Test Control System
- PA1000 power analyzer
- TS2000 automatic probe station
- TS200 8-inch manual probe station
- F3 Single Point Film Thickness Tester
- Candela CS920 Surface Defect Detector
- P170 fully automatic wafer probe profilometer/stair step meter
- NX Hivac High Vacuum Atomic Force Microscope
- NX-PTR fully automatic online detection atomic force microscope
- NX-HDM fully automatic defect detection atomic force microscope
- P17 automatic wafer probe profilometer/stair step meter
- NX Wafer Fully Automated Wafer Inspection Atomic Force Microscope
- NX-3DM Rotating Fully Automatic Atomic Force Microscope
- Nano observer electrical atomic force microscope
- EM-AFM electron microscope in situ atomic force microscope
- Cathodic Fluorescence Imaging Spectral Detection System
- SERS chip substrate
- Multi functional maskless laser direct writing
- Optical surface defect analyzer
- Maskless laser direct writing
- Explorer Electron Beam, Magnetron, Thermal Evaporation Thin Film Deposition
- DV-502 Thermal Evaporation Thin Film Deposition
- Desktop Pro Thin Film Deposition - Magnetron Sputtering
- BenchTop Turbo Thermal Evaporation and Sample Preparation
- Desk V Thin Film Deposition Solution
- Hyperspectral microscope
- Freeform Surface 3D Shape Tester
- Wafer warpage stress measuring instrument
- Internal stress detector
- Semi automatic wafer bonding machine
- proximity aligner
- Array pressure sensing system
- Atomic layer deposition system ALD products
- Electron microscope sample cleaning machine
- CMP20 electrochemical mechanical polishing machine
- Laser interference lithography machine
- VITA reactive ion etching machine (vertical chamber)
- COWIN High Throughput Integrated Plasma Reaction Ion Etching Cleaning System
- LAVIDA Paraxylene Coating Equipment
- Co series desktop plasma etching machine cleaning machine
- CLONE dual-mode plasma etching machine cleaning machine
- Liquid particle size analyzer
- EzAFM portable atomic force microscope
- Laser sampling
- Precision glass cutting machine (desktop type)
- ADR low-temperature constant temperature dry mK system
- Liquid Particle Sizer - LPC
- High temperature 3D printer
- Block resistance tester
- S100 type digital source table
- NX12 Biological Atomic Force Microscope
- Zeta-388 automatic multi-mode optical profilometer
- TS200-HP high-power probe station
- Zeta-300 multi-mode optical profilometer
- TS2000-DP high-power probe station
- TS50 manual small probe station
- TS2500-RF Fully Automatic RF Probe Station
- TS3000 automatic probe station
- MicroXAM800 White Light Interferometer
- TS300 12 inch manual probe station
- MDO34 oscilloscope
- In situ AFM in SEM
- Pulse laser deposition system (PLD)
- Active Vibration Isolation Platform AMT
- Duramin-100 hardness tester
- 3-inch nanoimprint machine NIL75
- In situ automatic nanomanipulation system
- In situ MEMS chips and synchrotron radiation holders
- In SEM HT high-temperature in-situ nanoindentation instrument
- Duramin-4 hardness tester
- High temperature in-situ nanoindentation instrument
- Active isolation table ARISTT
- Active isolation table ARISMD
- Passive vibration isolation SOTOT
- Passive isolation table GWA-M
- Passive isolation table GWA-TO
- Active isolation table PMT
- Diener Pico plasma cleaning machine
- Diener FEMTO plasma cleaning machine
- FT-NMT04 Nano Mechanical Performance Testing System
- ACCUTOM-10/-100 cutting equipment
- X1 series digital adjustable drying cabinet
- EZ series stereomicroscope
- DM 4500P semi-automatic intelligent digital polarizing microscope
- Leica M Series Stereoscopic Microscope LeicaM165FC/205FA
- S series stereomicroscope
- Leica M Series Stereoscopic Microscope LeicaM125/165C/205C/205A
- DM750P professional polarizing microscope
- EUV/X-ray reflector
- X-ray Fresnel zone plate (FZP)
- Grating template
- MPI Titan RF Accessories
- GGB microwave probe
- Quantifoil porous mesh carrier
- GGB calibration standard sample
- Customized vibration isolation system
- Ion beam etching/deposition system
- Silicon nitride thin film window
- AFM substrate
- AFM probe
- MPI RF calibration substrate
- GGB active high impedance needle tip
- GGB DC probe
- Hole shaped template
- Prism coupler
- Duramin-40 hardness tester
- 4-inch nanoimprint machine NIL-100
- Leica room temperature ultra-thin slicer Leica EM UC7
- Film thickness measuring instrument
- BI-2500 desktop surface plasmon resonance analyzer
- Established Active Vibration Isolation Platform
- BI-4500 high-throughput fully automatic surface plasmon resonance analyzer
- TS150-HP high-power probe station
- Scanwave Scanning Microwave Near Field Impedance Microscope
- MVI scattering scanning near-field optical microscope
- TS150 6-inch manual probe station
- 4200A-SCS parameter analyzer
- F40 Microscopic Film Thickness Measuring Instrument
- Zeta20 multi-mode 3D optical profilometer
Shanghai Nateng Instrument Co., Ltd
Wafer warpage stress measuring instrument
NegotiableUpdate on 01/24
- Model
- Nature of the Manufacturer
- Producers
- Product Category
- Place of Origin
Overview
Wafer warpage stress measuring instrument
Product Details
Stress Mapper Wafer warpage stress measuring instrument
Capable of detecting three-dimensional warping (flatness) and film stress, suitable for semiconductor wafer production, semiconductor process development, glass and ceramic wafer production
Similar Product Recommend
