Wafer glue baking machine (glue baking table)

Product Features

1.HMS-901ASPWafer glue baking machine (glue baking table)Adopting enhanced infrared heating technology with vacuum negative pressure function, the surface is equipped with several adsorption holes, which can tightly adhere the heated material to the surface, thereby achieving uniform heating effect.

2. Equipped with a heating and insulation cover, the temperature can be set, and the entire heating area forms an insulation chamber, greatly improving temperature uniformity and also playing a role in dust prevention.

3. Automatic intake function, over temperature protection function, over temperature alarm function, timing function, CE certification has been obtained, making experiments safer and more convenient!!

HMS-901ASPWafer glue baking machine (glue baking table)Parameter introduction:

1. Heating output power: 2000W

2. Board temperature control: room temperature~350 ℃

3. Temperature control mode: LED digital display temperature can be freely set

4. Temperature testing: Built in temperature control and external temperature control can be switched

5. Temperature control accuracy: ± 0.1

6. Heating zone: 220 × 220mm

7. Function options: Vacuum adsorption function: infinitely adjust the vacuum degree to make the sample heated more evenly

8. Top pin function: diameter 3mm, height 30mm, freely set height for easy removal of samples, no contact with samples, avoiding contamination

9. Limit function: Suitable for wafers of different sizes to prevent sample deviation and provide a fixing effect

10. Program segmentation control system: time setting, power output ratio setting, temperature rise curve, communication, etc

11. Product dimensions: 220 × 350 × 180mm

12. Board material: Nano ceramic sandblasted heating panel