Photolithography glue baking machine (wafer glue baking machine)

NegotiableUpdate on 02/04

Model

Nature of the Manufacturer: Producers

Product Category

Place of Origin

Online Consult

Overview

The photolithography baking machine (constant temperature heating) from the baking machine manufacturer can be equipped with an insulation cover, forming an insulation chamber in the entire heating area, greatly improving temperature uniformity and also playing a role in dust prevention; The machine can be equipped with negative pressure function and has several adsorption holes on the surface, which can make the heated material closely adhere to the surface of the heating plate, achieving uniform heating effect.

Product Details

Photolithography glue baking machine (wafer glue baking machine)Product advantages and features:

1. Optional with insulation cover, the entire heating area forms an insulation chamber, greatly improving temperature uniformity and also playing a role in dust prevention;

2. The machine can be equipped with negative pressure function and has several adsorption holes on the surface, which can make the heated material closely adhere to the surface of the heating plate, achieving uniform heating effect;

3. Protection from magnetic interference and hazards: making it a good choice for silicon wafer research and development, medical and laboratory use

4. Enhance infrared heating technology,

5. It has a vacuum negative pressure function and is equipped with several adsorption holes on the surface, which can tightly adhere the heated material to the surface, thereby achieving uniform heating effect;

6. Equipped with a heating and insulation cover, the temperature can be set, and the entire heating area forms an insulation chamber, greatly improving temperature uniformity and also playing a role in dust prevention;

7. Automatic air intake function, over temperature protection function, over temperature alarm function, timing function, CE certification has been obtained, making experiments safer and more convenient!!

Photolithography glue baking machine (wafer glue baking machine)Technical Specifications:

Heating output power	2000W
Board surface temperature control	Room temperature~350 ℃
Temperature Control Mode	LED digital display temperature can be freely set
Temperature test	Built in temperature control and external temperature control can be switched
Temperature control accuracy	±0.1
heating zone	350 × 350mm (size can be customized)
Function Options	Vacuum adsorption function: infinitely adjust the vacuum degree to make the sample heated more evenly;
Top pin function	Diameter of 3mm, height of 30mm, freely set height for easy sample retrieval, non-contact sample to avoid contamination;
Limit function	Suitable for wafers of different sizes to prevent sample deviation and serve as a fixing mechanism;
Program segmentation control system	Time setting, power output ratio setting, heating curve, communication, etc
Product dimensions	420×460×250mm
Board material	Nano ceramic sandblasting heating panel

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