Wafer bonding machine

EVG 510 Wafer Bonding System

EVG 510Wafer bonding system

Wafer bonding system for research and development or small-scale production-Compatible with large-scale production equipment *

EVG510It is a highly flexible wafer bonding system that can process from substrate to wafer200 mmThe substrate size. This tool supports all common wafer bonding processes, such as anode, glass powder, solder, eutectic, transient liquid phase, and direct method. The easy-to-use bonding chamber and tool design allow for quick and convenient re tooling of different wafer sizes and processes, with conversion time less than5minute. This multifunctionality is very suitable for universities, research and development institutions, or small-scale production applications.EVGLarge scale manufacturing tools (such asEVG GEMINI）The design of the bonding chamber is the same, and the bonding formula is easy to transfer, making it easy to expand production scale.

feature

*Uniformity of pressure and temperature

compatibleEVGMechanical and optical aligners

Flexible design and configuration for research and experimentation

Forming a single chip into a wafer

Various processes (eutectic, solder,TLP, direct bonding)

Optional turbo pump（<1E-5 mbar）

Upgradeable for anodic bonding

Open room design, easy to convert and maintain

Production compatibility

High throughput, with fast heating and pumping specifications

High yield achieved through automatic wedge compensation

Open room design for quick conversion and maintenance

200The Millimeter Adhesive SystemzuiSmall footprint:0.8square meter

recipe andEVGThe large-scale production adhesive system is compatible

Technical data:

zuiLarge contact force:10、20The60 kN Heater size150millimeter200millimeter

zuiSmall substrate size single chip100millimeter

Vacuum: Standard:0.1Millibars ; Optional:1E-5 mbar