Dry cleaning plasma cleaning machine

1、 Equipment working principlereason

Plasma is a state of matter in which the following substances exist: electrons in high-speed motion; Neutral atoms, molecules, and atomic groups (free radicals) in an activated state; Ionized atoms and molecules; Unreacted molecules, atoms, etc., but the substance remains electrically neutral overall.

The Trymax NEO Series utilizes the properties of these active components to treat the surface of the sample. Under certain vacuum conditions, it generates high-energy disordered plasma through radio frequency/microwave power supply. The plasma bombards the surface of the cleaned product to achieve cleaning, modification, photoresist ashing, and other purposes.

IITrymax NEO Series shoulduse

Previous passage:Light Etching； Descum strip； PR Ashing； After ion implantation, photolithography, and coating processes; Rear channel/Advanced packaging/3D IC：Descum Bumping； MEMS； Plasma Treatment； Wafer Cleaning, etc.

DispenseMate®The dispensing control technology provided by the system is based onNorthern ASYMTEKAdvanced online dispensing system, including closed-loop controlDCServo motion control systemJet- on-the-FlySpray dispensing function and customer oriented, intuitively programmableFluidmove ®software

Other standard features include an integrated mechanical height detector and a fully automatic recognition visual system with a program-controlled light source. In addition, the standard configuration also includes a programmable closed-loop nozzle and a needle heating control that can be programmed to monitor temperature and record data. It also includes dynamic dispensing control that enables small point dispensing.

offline MFC/CPJisD-593The standard performance of the model, By weighing the sample within the user's numerical range and manually inputting the measurement value toFluidmoveImplement automatic traffic calculation in China.

FluidmoveThe programming program is upward compatible and can be easily transferred to other programsNordson ASYMTEKThe online system, includingSpectrum II^TMandQuantum®Glue dispensing platform.

In addition,FluidmoveSoftware providedSPCData recording for process traceability and optionalCADImport.

From mass production to large-scale production, users will always receiveNordson ASYMTEKSupported by a globally experienced network of engineering, application development, and technical services.

TrymaxAdvanced plasma ashing and etchingNEO300A/NEO200ASeries platform

NEO300AThe series platform isTrymaxSemiconductor equipment industry ofNEOSeries of advanced plasma ashing and etching products One of the new members.

It is a fully automated single room system that can be configured with any existing oneTrymax NEOProcess module and diameter up to300mmThe substrate is compatible. Small footprintNEO300AThere is a single loading port configured.

• Features

- big300Millimeter wafer size/Substrate size

-Bridge tool capability200-300mm

-singleSMIFLoading port

-3Axis dual arm robot processing

-4Different processing modules:

• Downstream microwave（2.45 GHz）

RF bias voltage（13.56MHz）

Dual source (microwave, RF bias)

•DCP（RFBias, direct coupling plasma)

-Excellent uniformity and repeatability

-Mechanical throughput>100wph

-Compact footprint

-Very low cost of ownership

- Digital control,DevicenetEthernet

-Window based industrial computer

• Application programs

-Barrier strip

- Descumprocess

-Remove polymer

-Sending high-dose implant straps by mail

-Application of Silicon Nitride Etching

-MEMSapplication

-Packaging processing（PR，PI，BCB，PBO）

NEO200AThe series platform isTrymaxSemiconductor equipment industry ofNEOSeries of advanced ashing and etching products new blood.

It is a fully automated single room system that can be configured with any existing oneTrymax NEOProcess module and diameter up to200mmThe substrate is compatible. Small footprintNEO200AEquipped with dual cassette tapes.

• Features

- big200 mmwafer size/Substrate size

-Double box platform

-3Axis dual arm robot processing

-4Different processing modules:

• Downstream microwave（2.45 GHz）

RF bias voltage（13.56MHz）

Dual source (microwave, RF bias)

•DCP（RFBias, direct coupling plasma)

-Excellent uniformity and repeatability

-Mechanical throughput>100wph

-Compact footprint

-Very low cost of ownership

- Digital control,DevicenetEthernet

-Window based industrial computer

• Application programs

-Barrier strip

- Descumprocess

-Remove polymer

-Sending high-dose implant straps by mail

-Application of Silicon Nitride Etching

-MEMSapplication

-Packaging processing（PR，PI，BCB，PBO）

Trymax Semiconductor EquipmentofNEO200Advanced plasma ashing series/The etching system is New photoresist and etching equipment offered at astonishing prices The performance. specially designed for big200 mmDesigned for substrate applications.

It is equipped with a flexible loading station that can be configured to handle big200 mmAll substrates of different sizes.

NEO200The series integrates all the requirements for compact design of research and equipment manufacturers, and can achieve Low cost of ownership.

• Features

- big200 mmwafer size/Substrate size

-A single loading platform for semi-automatic wafer transfer.

-4Different processing modules:

• Downstream microwave（2.45 GHz）

RF bias voltage（13.56MHz）

Dual source (microwave, RF bias)

•DCP（RFBias, direct coupling plasma)

-Excellent uniformity and repeatability

-Compact footprint

-Very low cost of ownership

- Digital control,DevicenetEthernet

-Window based industrial computer

• Application programs

-Barrier strip

- Descumprocess

-Remove polymer

-Sending high-dose implant straps by mail

-Application of Silicon Nitride Etching

-MEMSapplication

-Packaging processing（PR，PI，BCB，PBO）