Automatic Atomic Force Microscope AAFM

BRuker fully automatic atomic force microscope InSight AFP

——The fifth generation AFP has high resolution, fast molding speed, and fast 3D mold mapping in the industry

InSight AFP is the world's most high-performance and industry-leading advanced technology node CMP profile and etching depth measurement system. By combining its modern tip end scanner with an inherent stable capacitive pressure gauge and precise air bearing positioning system, non-destructive direct measurements can be made in the active area of the mold.

·0.3 nanometer long-term stability
provideNIST traceable reference metrology and maintains measurement stability within one year

·260-340 sites/hour
Inline applications*High production efficiency
reduceMAM time and optimized wafer processing can maintain a throughput of up to 50 wafers per hour

·Up to 36000 micrometers per second
仿形速度
Provide high resolution through hotspot recognition3D features

·*High resolution, long tip end lifespan
TrueSense for InSight AFP ® Technology with long scanning capability verified by atomic force analyzer. The etching depth, indentation, and erosion of submicron features can Automated monitoring with Repeatability without relying on test keys or models.

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Etching andFully automatic online process control of CMP chips

Insight AFP combines new innovations in atomic force microscopy, including Bruker's proprietary CDMode, for characterizing sidewall features and roughness. CDmode reduces the required number of cross-sections and achieves significant cost savings. In addition, AFP data provides direct measurements of sidewall roughness that cannot be obtained through other techniques.

Automatic defect review and classification

The device defects in today's integrated circuits are smaller than ever before and require quick resolutionHVM requirements. InSight AFP provides fast and actionable terrain and material information about semiconductor chip and PHTOmask defects, enabling manufacturers to quickly identify defect sources and eliminate their impact on production.

100x high-resolution registration of optical elements and AFM global alignment can achieve a placement accuracy of less than ± 250 nm for the original images of patterned wafers and masks, ensuring that the defects of interest are measured defects. This system is compatible with KLARITY and most other YMS systems Compatible.

3D Mold Mapping and HyperMap ™

Analysis speed up to36000μm/sec， Capable of fast and complete 3D CMP characterization and inspection of flash fields of 33mm x 26mm and larger. Ultra 2 nanometer out of plane motion enables true large-scale terrain and fully automatic hot spot detection after polishing.

In this example, inA complete standard 26mm x 33mm crosshair field scan was obtained within 24 hours with a pixel size of 1 micron x 1 micron. Then Bruker's hotspot detection and review function can be used to automatically detect and rescan hotspots.

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BRuker fully automatic atomic force microscope InSight CAP

——Compact high-performance profiler and AFM

Bruker's InSight CAP automatic atomic force profiler is a CMP and etching metrology combination platform designed specifically for semiconductor manufacturers and suppliers. Flexible configuration supports wafer sizes ranging from 100mm to 300mm, enabling precise measurements for a wide range of terminal applications. From high productivity laboratories to fully automated factories, InSight CAP profiler can optimize configurations to achieve cost-effective metrology solutions.

·<0.5 nm Long term Dynamic Reproducibility

Direct and stable online measurement for critical process decision-making

·Sub nanometer
Sensitivity of CMP automatic measurement, dedicated disc and corrosion measurement package, used for Process Control and Development

·<20nm
The flatness of the imitation is greater than26mm
Targeting key issuesHigh precision CMP flatness measurement for EUV lithography technology development and process control

The online measurement results are measured in minutes and are applicable to etching andTechnical development and process control of CMP

At advanced technology nodes, multi-mode lithography technology plays a crucial roleCMP proposes nanoscale process control requirements to meet the depth of focus requirements. InSight CAP is built around a new generation AFM scanner, providing improved flatness in the 65 μ m X/Y scanning range, less than 10 nanometers. The NanoScope of this system ® The V 64 bit AFM controller provides 5x faster meshing performance and 5x faster adjustment speed to improve production efficiency, all of which enhance reliability. Its DT adaptive scanning mode also helps to accelerate scanning speed and improve metrology. The InSight CAP high-resolution profiler combines multiple advanced features to achieve angstrom level accuracy measurements in macroscopic depressions and erosion.

Flexible configuration support fromWafer sizes ranging from 100mm to 300mm enable precise measurement for a wide range of terminal applications. From high productivity laboratories to fully automated factories, InSight CAP profiler can optimize configurations to achieve cost-effective metrology solutions.

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