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Uniform glue spin coating machine

NegotiableUpdate on 02/02
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Overview
The uniform glue spin coating machine, also known as the uniform glue machine or spin coating machine, is suitable for surface coating processes such as semiconductors, silicon wafers, chips, substrates, conductive glass, and plate making using the Laurel 650 series uniform glue machine from the United States.
Product Details

Uniform glue spin coating machineWS-650On a high-speed rotating substrate, various types of adhesive liquids are dripped and uniformly coated on the substrate using centrifugal force. The rotation speed and time, as well as the viscosity coefficient between the adhesive liquid and the substrate, all affect the film thickness. The stability of the rotation process and the rotation system also have a significant impact on the film quality.



1. Sample size: 3~300mm

2. Acceleration: 80000rpm/s (unloaded), 30000rpm/s (loaded: 100mm standard wafer)

3. Speed: 1-12000rpm, servo motor resolution 4000P/rev

4. Rotation direction: Optional Hz motor with adjustable rotation direction in both directions

CDA/N2 airflow protection technology

6. Optional automatic dispensing module and EBR wafer edge removal module

7. Multiple trays to choose from, suitable for samples of various materials



Uniform glue spin coating machineTray Solution

1. Common vacuum trays: 10-150mm do not need to be replaced.

2. Embedded: A circular groove is made in the middle of the tray, into which the sample can be embedded to avoid gas vortex effects caused by excessive sample thickness.

3. Honeycomb type: suitable for ultra-thin and easily deformable soft materials and fragile materials.

4. Cartridge tray: Suitable for samples that cannot be vacuum adsorbed or samples that need to be processed on both sides. When fixing, it is necessary to minimize the contact area with the tray. Cartridge trays can also be used, and the rotation speed should not be too high when using them.


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