UV lithography

NegotiableUpdate on 02/10

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Nature of the Manufacturer: Producers

Product Category

Place of Origin

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Overview

Direct writing lithography processing devices, domestically produced direct writing lithography equipment, UV lithography: Laser direct writing equipment is mainly used for direct exposure transfer of microstructure patterns without masks to prepare diffractive optical elements and microelectromechanical systems. Various substrates coated with photoresist are directly exposed without a mask, such as glass, silicon wafers, or other planar materials, and will be used as diffractive optical elements and microelectromechanical system processing platform equipment.

Product Details

UV lithography_AODLaser direct writing equipment is mainly used for maskless direct exposure transfer of microstructure patterns to prepare diffractive optical elements and microelectromechanical systems. Various substrates coated with photoresist are directly exposed without a mask, such as glass, silicon wafers, or other planar materials, and will be used as diffractive optical elements and microelectromechanical system processing platform equipment.

UV lithography_AODWrite performance parameters directly
Writing Head	high-resolution	100×	50×	20×	10×	5×
Minimum feature size (μ m)	0.25	0.3	0.6	1	2	4
Roughness (3 σ, nm)	50	60	70	80	110	160
CD uniformity (3 σ, nm)	50	60	80	130	180	250
Engraving accuracy 100 × 100mm ² (nm)	300	300	500	500	800	1000
Write speed mm ²/min	5	15	40	150	600	2000
100 × 100mm ² engraving time (min)	3000	740	255	72	20	7
System Features
light source	405nm or 375nm
Substrate size	Maximum 9 inches
Substrate thickness	0.1mm~15mm
Maximum exposure area	200×200mm²
temperature stability	±0.1°
gray level	4096
scalability	Support multi-channel expansion
Featured Features
Script based writing mode	Provide a scripting programming interface that supports user-defined machining structures
Engraving and slicing software	Supports multiple formats such as JPG, TIFF, GDS, etc
Real time autofocus	optical Zoom
Auto focus range	100μm
system accessories
objective lens	5 x, 10 x, 20 x, 50 x, 100 x, optional high-resolution lens
system dimensions
length, width, height	1320mm×1320mm×2000mm
weight	1100KG
Installation requirements
Electrical conditions	230VAC±5%，50/60Hz,16A
ambient temperature	Temperature: 21 ± 1 degrees Celsius, humidity: 50%~70%, no condensation
compressed air	6-9bar,±0.5bar
ambient lighting	yellow light
cleanliness level	Class 1000 cleanroom