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Beijing Yakechenxu Technology Co., Ltd

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    Room 616, 6th Floor, Zhaowei Building, No. 14 Jiuxianqiao Road, Chaoyang District, Beijing

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UV Nanoimprint Machine

NegotiableUpdate on 05/08
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Overview

Universal research and development mask alignment system with ultraviolet nanoimprint function, ranging from small pieces to up to 150mm in size

Product Details

EVG®610 UV Nanoimprint Lithography System

EVG ® 610 UV Nanoimprint Lithography System


Universal research and development mask alignment system with ultraviolet nanoimprint function, from small to large150 millimeters


Technical data

This tool supports multiple standard lithography processes, such as vacuum, soft, hard, and near exposure modes, and can select backside alignment. In addition, the system also provides additional features for multifunctional configurations, including bond alignment and nanoimprint lithography(NIL)。

EVG610 provides fast processing and reinstallation tools to change user needs, with a conversion time between lithography and NIL of only a few minutes. Its advanced multi-user concept can adapt to all needs from beginners to experts, making it highly suitable for university and R&D applications.

For the embossing process,EVG610 allows the substrate to range from small chip size to a diameter of 150 millimeters. In addition to programmable high and low contact forces, the configuration of nanotechnology applications can also include a release mechanism for stamps. EV Group's proprietary chuck design provides uniform contact force to achieve high-yield imprinting, and the chuck supports both soft and hard impressions.



feature

Top and bottom alignment capability

High precision alignment table

Automatic wedge error compensation mechanism

Exposure gap controlled by electric and formula

supportnewofUV-LED technology

Small scale system footprint and facility requirements

Step by step process guidance

Remote technical support

Multi user concept (unlimited number of user accounts and recipes, assignable access permissions, different user interface languages)

The transition between agile processing and photolithography processes; Desktop or standalone version with seismic resistant granite platform

Additional features: key alignment, infrared alignment, nanoimprint lithography, µ contact printing


Technical data

Wafer diameter (substrate size) standard lithography: large150mm fragments; SoftUV-NIL: Fragments up to 150 millimeters in size

Resolution ≤40 nm (resolution depends on template and process)

Support process

softUV-NIL

Exposure source: Mercury light source or ultraviolet lightLED light source

Automatic separation: not supported;

Production of work seal: external;

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