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Address
Room 616, 6th Floor, Zhaowei Building, No. 14 Jiuxianqiao Road, Chaoyang District, Beijing
Beijing Yakechenxu Technology Co., Ltd
Room 616, 6th Floor, Zhaowei Building, No. 14 Jiuxianqiao Road, Chaoyang District, Beijing
EVG®610 UV Nanoimprint Lithography System
EVG ® 610 UV Nanoimprint Lithography System
Universal research and development mask alignment system with ultraviolet nanoimprint function, from small to large150 millimeters
Technical data
This tool supports multiple standard lithography processes, such as vacuum, soft, hard, and near exposure modes, and can select backside alignment. In addition, the system also provides additional features for multifunctional configurations, including bond alignment and nanoimprint lithography(NIL)。
EVG610 provides fast processing and reinstallation tools to change user needs, with a conversion time between lithography and NIL of only a few minutes. Its advanced multi-user concept can adapt to all needs from beginners to experts, making it highly suitable for university and R&D applications.
For the embossing process,EVG610 allows the substrate to range from small chip size to a diameter of 150 millimeters. In addition to programmable high and low contact forces, the configuration of nanotechnology applications can also include a release mechanism for stamps. EV Group's proprietary chuck design provides uniform contact force to achieve high-yield imprinting, and the chuck supports both soft and hard impressions.
feature
Top and bottom alignment capability
High precision alignment table
Automatic wedge error compensation mechanism
Exposure gap controlled by electric and formula
supportnewofUV-LED technology
Small scale system footprint and facility requirements
Step by step process guidance
Remote technical support
Multi user concept (unlimited number of user accounts and recipes, assignable access permissions, different user interface languages)
The transition between agile processing and photolithography processes; Desktop or standalone version with seismic resistant granite platform
Additional features: key alignment, infrared alignment, nanoimprint lithography, µ contact printing
Technical data
Wafer diameter (substrate size) standard lithography: large150mm fragments; SoftUV-NIL: Fragments up to 150 millimeters in size
Resolution ≤40 nm (resolution depends on template and process)
Support process
softUV-NIL
Exposure source: Mercury light source or ultraviolet lightLED light source
Automatic separation: not supported;
Production of work seal: external;
