Spare parts RUBBER DESIGN shock absorbers

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Spare parts RUBBER DESIGN shock absorbers

Spare parts RUBBER DESIGN shock absorbers

MSE FILTER PRESS HEADPLATE KFP 800/KD25 GA4/TD/SWG

MSE FILTERPRESS NEW CONNECTION SYSTEM

MSE Filter Press Chamber Plate 800 KD25/TD/SWG

MSE FILTERPRESSEN ENDPLATTE 800 KD25/TD/SWG/KA-DN25

INFASTAUB AJB 800-980-22 P filter cartridge 310744

Diaphragm valve 030064 for INFASTAUB AJB 800-980-22 P

INFASTAUB AJB 800-980-22 P with membrane 300682

INFASTAUB AJB 800-980-22 P with controller 320234

INFASTAUB AJB 800-980-22 P with solenoid valve 320409

INFASTAUB AJB 800-980-22 P filter 300898

INFASTAUB AJM 300-500-1 P matched filter cartridge 302466

INFASTAUB AJM 300-500-1 P matching diaphragm valve 026200

INFASTAUB AJM 300-500-1 P matching membrane 011058

INFASTAUB AJM 900-500-15P filter cartridge 302466

Diaphragm valve 011057 for INFASTAUB AJM 900-500-15 P

INFASTAUB AJM 900-500-15 P with membrane 011058

INFASTAUB AJM 900-500-15P with controller 320255

INFASTAUB AJM 900-500-15P with solenoid valve 320409

INFASTAUB AJM 900-500-15P filter 300898

INFASTAUB AJV 640-980-15 P matching filter element 028913

INFASTAUB AJV 640-980-15 P matching diaphragm valve 030064

INFASTAUB AJV 640-980-15 P matching diaphragm 300682

INFASTAUB AJV 640-980-15 P matching controller 320234

INFASTAUB AJV 640-980-15 P matching solenoid valve 320409

INFASTAUB AJV 640-980-15 P matched filter 300898

SCHUNK 0371457 PGN-PLUS 380-2-AS

BRAUN 402051/999

ROLAND PW42AGS

HENGSTLER 0734007

SAMSON 4763-01200121000000

DENISON 701-00610-8

ALFING 8117294

ALFING 8513339

ALFING 8547598

MANNEKES 16A-6H/220-250V2P+T

MENNEKES 16A-6H/380-415V3P+T

MENNEKES 32A-6H/220-380V3P+N+T

KUHNKE 64.063-110VAC

JUNCOR 40440050003050 C.NITTA TC 50X3050MM ENDLESS (please confirm if the belt has an open end or a joint with ENDLESS) 4 pieces minimum order

HYDROTECHNIK 3185-03-35.030

HYDROTECHNIK 3107-00-45.00

ELECTRONICON 1030099 E62.G14-303G10

BRABENDER TITRATION PUMP FOR ABSORPTOMETER C

MULTI-CONTACT 30.4016 ROBIFIX-S-L

INFICON 510-027, HLD6000

INFICON 710-202-G1

BD-SENSORS 26.600 G-2503-R-1-8-C10-300-5K-000

LENORD+BAUER GEL293Y118

LENORD+BAUER GEL2037Y001

WAGNER-MAGNETE 752-ST/2 FE-1 130/31

CATTRON BT-923-00075 BATTERY NIMH 1.6 AH

GROSSFUNK GF – SENDER T 07 + EMPFANGER GF 2000I V2 / R99

HIRSCHMANN MA-9T/01 16001

COUDOINT SNE350X40S2-1KD040

PHOENIX SACC-M12FS-4QO-0,34 - 1641701

PHOENIX SACC-M12MS-4CON-PG9-VA-1553174

PHOENIX SACC-M12FR-4CON-PG7-1681130

PHOENIX SACC-M12MR-4CON-PG9-VA-1553226

HENGSTLER 0570856

MSE FILTERPRESSEN KD25/SWG

MSE FILTERPRESSEN KD25/SWG TD

LASER COMPONENTS FP-MVPICO-660-50-10-F90-KONF

CROWCON T4 PORTABLE MULTIGAS DETECTOR

EATON UNS1000-MS 0122-196

NARDA NRA-6000 RX

SCHUNK 9935815 SWO-R19-K

SCHUNK 9935816 SWO-R19-A

SCHUNK 0301294 KAS-19B-K-90-C

PHOENIX EBR40

WENGLOR FFAF149

KALINSKY DMU 2

ROLAND SHX42

KROHNE VFM3030FEX-XT-DN80

KROHNE VFM3030F-XTEX-DN50

INFICON HEATER FOR VBP160-Z,250-627

BINKS 502376

EUCHNER 088882 RPS3131SC100M

INTZA-WOERNER VP33/A-1/4-03/L2 020-R0202

INTZA-WOERNER VP33/A-1/4-00/L2 020-R0202

INTZA-WOERNER VP33/B-1/5-03LP P3PPR13PP3

EUCHNER 103267 GMOX-PR-12DN-C16

FINDER 20.22.9.024.4000

BONFIGLIOLI 309R4 457FP P132 B2

STERLING SAT 35026171

STERLING SAT 35013658

INFICON SQC310-4-E-2

SUHNER UAL 23RF ART. - NR. 06459305 (UAL 10R is a customized model for customers)

ISRA VISION 288-5-S-40V1.1

ISRA VISION P/N :S10902204

DANFOSS 18F6968 24VD. C/0.02KW

FUNKE TPL 00-K-12-11

ROLAND SM12CPM12S-GG

SAUNDERS AA040M62RHN

AERZEN 2000015543

SUPFINA ARTICLE 10025290 68822.20

BRAUN A5S05T90-5M

Mankenberg art. – Nr.: 6621403 sa- 1

ELECTRONICON 1030195 E62.G85-303G10

GESSMANN V61.1LB1KM-02ZC-A050C152

GESSMANN VV81LB3MK-3ZP-B-X-A050P184EU03KHL/1030

DENISON 701-00610-8

HARTING 09 03 196 9621

HARTING 09 03 296 6825

PHOENIX 3031238 Minimum order quantity 50 pieces

PHOENIX 1050017 Minimum order quantity 50 pieces

PHOENIX 3031212 Minimum order quantity 50 pieces

PHOENIX 3031225 minimum order quantity is 50 pieces

PHOENIX 1201442 Minimum order quantity 50 pieces

PHOENIX 3030417 minimum order quantity is 50 pieces

PHOENIX 1004348 Minimum order quantity is 100 pieces

PHOENIX 3031076 Minimum order quantity 50 pieces

PHOENIX 3030145 minimum order quantity is 50 pieces

PHOENIX 0824951 Minimum order quantity 50 pieces

PHOENIX 2891933

PHOENIX 2891018

PULSOTRONIC 9984-2065 120MA 5MM

PULSOTRONIC 9984-1150 10-120MM

MICRO-EPSILON CTLT15+3 M MESSKOPFKABEL

BINKS 502375

BINKS 502376

SCHUNK 0300345 PZB 64

SCHUNK 0324452 AGE-Z-050

SCHUNK 0370103 PGN 125/1

KNF PML 4053-NF60/11.2W/12VDC

GEFRAN KS-E-E-E-B16U-M-V

CONTITECH P 54-C8M-75-2BORDSCHEIBEND=¢71H7

CONTITECH P 60-C8M-75-2BORDSCHEIBEND=¢53H7

K+N CA10 A023-620 E is valid for the entire order

K+N C125 A213-620 E S2B G211 (PE does not exist, there are 4 holes on the front for installation)

K+N S3B G211

K+N C315 A200 -620 ER S3B G211

EATON-VICKERS MCSCH115AG000010

DUNKERMOTOREN GR63*55,8844208253

DUNKERMOTOREN GR42*25,8842701957

NOVOTECHNIK TRS-0050

HENGSTLER 0523292

DUFFNORTON 替代 SKA6000A10R

SIEMENS 5SM3344-4

FEIN 5356851144 BOP 10

HENNECKE F7620-100 089

HENNECKE D9509-703 971 D=26

HENNECKE D9541-007 152 D=32*1.2

SIEMENS 7MF1567-3DB00-5EA1

SIEMENS 7MF1567-3DD00-5EA1

ROLAND P42AGS + E20-4P-B-O + SHX42 + CPM12S-G

SONTHEIMER A3/11ZM /Z32/Z8

K&N CA10 F36828/001 model is incomplete and needs to be confirmed (missing information on electrical functions)

INFICON 3CC5-651-238B

INFICON 355-492

KETTENWULF 115/30.3X47，PA6

MULTI CONTACT 14003491-200

MULTI CONTACT 720005

SRM TECHNIK SR-M-PH 5 L0.7/ SN: 09091354

BODE COMPONENTS AGB069

LENZE CPC 2700 P/N:1160-0002

GESSMANN V62RDV-02ZC+02ZC-221

SCHMALENBERGER 59416X LAUFRAD SZ-M20X1,5-B61-2FLÜGEL

SCHMALENBERGER 45557 OPEN WHEEL 142X25-25-0.6020

ELECTRONICON E62.S23-204M30

GEFRAN F058483

MULTI-CONTACT 18.8005

MULTI-CONTACT 18.0301 MGK3VB10-14+MGK3R29

MULTI-CONTACT 18.4706 E3-36PE/B

STEINEL NEO-1

CONTRINEX DW-AS-607-M18-002

CONTRINEX RIT-1491-100

ORTLINGHAUS 0085-103-03-003000

SCHUNK 0362252 SRU-PLUS 40-W-180-90-8

NARDA EF0391

NARDA EHP-50F

SCHUNK 0371103 PGN-PLUS 125-1

NARDA RM2030

NARDA 6150AD-B

SUN RDJALCV

SUN DSCHXHV

SUN FXDALAN-30LPM

SUN RDDALEV

KARL KLEIN ENG1-1,2B/S P/N:71463-1.000

GEFEG-NECKAR K542 254200998 6UF/IP44 110V50/60HZ/200MA

FUNKE TPL 00-K-12-11

GUNNEBO S70003PCB

AVTRON HS35MYX6FPU0MA0 (please confirm the version of the plug or cable)

MEDIUM MKA20 1×0.5M

SILVENT 712315， SV209-L

MAGNETS4YOU STM-05X07-N

ROLAND IE42-30GS

GEFRAN F058483

GUTEKUNST D-235

BERNSTEIN 6502999018

CEJN 10-981-1588

SPANDAU PUMPEN PRK0302PBS275E05AA 0.37KW 380V/50HZ

SCHENCK V023643.B01

HEIDENHAIN 827039-16 subsequent compatible models

GFA Elektronic 25.15 - 30, 00

OMRON F3S-TGR-NMPC- 21-10

SCHUNK 0301130 MMS 22-PI2-S-M8-PNP-HD

PHOENIX 2708232

PHOENIX 2834070

HENGSTLER AC58/1212EK.42SCH

HENGSTLER AC58/1212EK.72SGX:6251

BINKS 502375

BINKS 502376

SCHLEUNLGER UNISTRIP2300

VENTUR 436511300 SC50C1500T MIT MOTOR IE3 TP/PTC 400/690V,50HZ

CONTRINEX CXG24C-512-BN-V30-M7-050

BINKS 502375

BINKS 502376

KNF 025202/024910 N85.3KNDC

KNOLL AMHE 90LCA2

NORELEM 07144-508

DUNKERMOTOREN 88437 07503 GR 53X30

DR.BRANDT 007090004G03/AN-SZ(4-20MA)/LP909

INOR 66RNS06212LWX07XFDKTNPT1/230+

KAYDON KG 200 CPO 508,00 X 558,80 X 25,40 MM

CONTRINEX DW-AS-603-C44-304

RHEONIK RHM15L-N1-P1-PM0-M1-D1-JM-NN-A1-SE-N-A/B

SCHUNK 0302308 SWA-005-000-000

SCHUNK 0302307 SWK-005-000-000

PROXITRON IKQ 100T.38 G S4

LUFTTECHNIK SD101 NW 200 MM WITH CORE 120 MM

KNOLL SP50-550

GFA ELEKTROMATEN SG63F_25.15 ART.10003166.00011

CRANE PF090200150001

SVENDBORG 1712-1024-001

(small Out-Line package)

Small form factor packaging. One of the surface mount packages, the pins are led out from both sides of the package in a seagull shaped (L-shaped) pattern. There are two types of materials: plastic and ceramic. Also known as SOL and DFP.

SOP is not only used for memory LSI, but also widely used in circuits such as ASSP that are not very large in scale. SOP is a popular surface mount packaging in fields where the input and output terminals do not exceed 10-40. The center distance of the pins is 1.27mm, and the number of pins ranges from 8 to 44.

In addition, SOP with pin center distance less than 1.27mm is also known as SSOP; SOP with assembly height less than 1.27mm is also known as TSOP (see SSOP, TSOP). There is also an SOP with heat sinks.

66、SOW

(Small Outline Package(Wide-Jype))

Wide body SOP. The names used by some semiconductor manufacturers.

manufacture

Since the 1930s, semiconductors among the chemical elements in the periodic table have been considered by researchers such as William Shockley of Bell Laboratories as the most likely raw materials for solid-state vacuum tubes. From copper oxide to germanium, and then to silicon, raw materials were systematically studied in the 1940s and 1950s. Today, although some III-V valence compounds of the periodic table, such as gallium arsenide, are used for special purposes such as light-emitting diodes, lasers, solar cells, and high-speed integrated circuits, single crystal silicon has become the mainstream substrate for integrated circuits. The method of creating defect free crystals took decades.

The semiconductor IC process includes the following steps and is reused:

Yellow light (micro shadow)

etching

film

diffusion

CMP

Use single crystal silicon wafers (or III-V group, such as gallium arsenide) as the substrate. Then, MOSFET or BJT components are made using techniques such as lithography, diffusion, CMP, etc., and wires are made using lithography, thin film, and CMP techniques to complete chip fabrication. Due to product performance requirements and cost considerations, wires can be divided into aluminum and copper processes.

IC is composed of many overlapping layers, each defined by image technology and typically represented by different colors. Some layers indicate where different dopants diffuse into the base layer (becoming diffusion layers), some define where additional ion implantation occurs (implantation layers), some define conductors (polycrystalline silicon or metal layers), and some define the connections between conductive layers (via holes or contact layers). All components are composed of specific combinations of these layers.

In a self arranging (CMOS) process, all gate layers (polycrystalline silicon or metal) pass through the diffusion layer to form a transistor.

The resistance structure, the aspect ratio of the resistance structure, combined with the surface resistivity, determines the resistance.

Due to size limitations, capacitor structures can only generate very small capacitors on ICs.

A more rare inductance structure can be used to make chip loaded inductors or simulated by a cyclotron.

Because CMOS devices only direct current conversion between logic gates, they consume much less current than two-stage components.

Random access memory is the most common type of integrated circuit, so the highest density device is memory, but even microprocessors have memory. Although the structure is very complex - the chip width has been decreasing for decades - the layers of integrated circuits are still much thinner than the width. The production of component layers is very similar to the photographic process. Although light waves in the visible spectrum cannot be used to expose component layers because they are too large. High frequency photons (usually ultraviolet light) are used to create patterns on each layer. Because each feature is very small, an electron microscope is a necessary tool for a process engineer who is debugging the manufacturing process.

Before packaging with automated testing equipment (ATE), each device must undergo testing. The testing process is called wafer testing or wafer probing. The wafer is cut into rectangular blocks, each called a 'die'. Each good die is soldered onto aluminum or gold wires on "pads" that are connected inside the package, with pads typically on the edges of the die. After packaging, the equipment undergoes final inspection on the same or similar ATE used in wafer probing. The testing cost can reach 25% of the manufacturing cost of low-cost products, but for low output, large and/or high cost equipment, it can be ignored.

In 2005, the construction cost of a manufacturing plant (usually referred to as a semiconductor factory, often abbreviated as fab, referring to a fabrication facility) exceeded $1 billion because most operations were automated.

development trend

From 2001 to 2010, the average annual growth rate of integrated circuit production in China exceeded 25%, while the average annual growth rate of integrated circuit sales reached 23%. In 2010, the domestic production of integrated circuits reached 64 billion pieces, with sales exceeding 143 billion yuan, which were 10 times and 8 times higher than in 2001, respectively. The scale of China's integrated circuit industry has increased from less than 2% of the world's total integrated circuit industry in 2001 to nearly 9% in 2010. China has become one of the fastest developing regions in the world's integrated circuit industry in the past decade.

The size of the domestic integrated circuit market has also expanded from 114 billion yuan in 2001 to 735 billion yuan in 2010, an increase of 6.5 times. The ratio of the scale of the domestic integrated circuit industry to the market size has never exceeded 20%. If the sales revenue from overseas outsourcing in the integrated circuit industry is deducted, the actual domestic self-sufficiency rate of China's integrated circuit market is still less than 10%, and the integrated circuit products needed in the domestic market mainly rely on imports. In recent years, the import scale of integrated circuits in China has rapidly expanded, reaching a record high of 157 billion US dollars in 2010. Integrated circuits have surpassed crude oil as a major imported commodity for two consecutive years. Compared with the huge and rapidly growing domestic market, China's integrated circuit industry, although developing rapidly, still struggles to meet domestic demand requirements.

At present, the rapid development of strategic emerging industries represented by mobile Internet, three networks integration, Internet of Things, cloud computing, smart grid, and new energy vehicles will become a new driving force to promote the development of integrated circuit industry after computers, network communications, and consumer electronics. The Ministry of Industry and Information Technology predicts that the domestic integrated circuit market will reach 1.2 trillion yuan by 2015.

The ecological environment for the development of China's integrated circuit industry urgently needs to be optimized. The coordination between the upstream and downstream of the design, manufacturing, packaging and testing, as well as specialized equipment, instruments, materials and other industrial chains is insufficient, and the interaction between chips, software, complete machines, systems, applications and other links is not close. During the 12th Five Year Plan period, China will actively explore the virtual integration mode of the upstream and downstream of the integrated circuit industry chain, fully leverage the role of market mechanisms, strengthen cooperation and collaboration between the upstream and downstream of the industry chain, and jointly build the value chain. Cultivate and enhance the ecological environment, strengthen the organic connection between integrated circuit product design and software, complete machines, systems, and services, achieve the collective leap of enterprises in various links, and enhance the overall competitive advantage of the electronic information industry chain.

In 2023, the universal testing device for components and modules outside the Wentian experimental module will conduct space environmental effect tests on large-scale integrated circuits and new semiconductor devices.

Development strategy suggestions

1. Innovative efficiency surpasses traditional cost based static efficiency

In theory, business costs belong to the static efficiency category of cost, and play a significant role in the primary stage of industrial development. The rise in external business costs is actually an external driving force for industrial upgrading and innovation. As a high-tech industry, the integrated circuit industry in Shanghai needs to actively utilize its cluster advantages such as a complete industrial chain, high internal networking, and organic connection with the global production network to achieve the ecological relationship of the high-tech industry body of interaction and symbiosis between enterprises, effectively ensuring and promoting the pace of industrial entrepreneurship and innovation. The fact shows that in the 1980s, although land costs in Silicon Valley were much higher than those in the 128 Highway area, semiconductor companies established in Silicon Valley developed new products 60% faster and shipped products 40% faster than companies in other parts of the United States. Specifically, hardware and software manufacturers in the Silicon Valley region have formed a close alliance, which can minimize the costs of related processes from creativity to product manufacturing. This is achieved through a dynamic entrepreneurial alliance based on technology intensive associations, which reduces entrepreneurial costs and compensates for the disadvantage of static business costs.

2. Accurate product and market positioning

Many design talents who return to China to start businesses believe that compared to developed countries in Europe and America, our consumers in China are curious about new products and generally do not return them, with little compensation. These characteristics provide good market opportunities for the entrepreneurship, innovation, and development of design enterprises. Enterprises should be good at discovering product applications and searching for markets.

The expansion of design companies is mainly limited by talent and product positioning. Due to deficiencies in talent teams, markets, and product definitions, startups are unable to undertake large-scale projects and are not suitable for clustered large-scale projects. Most existing design companies are still suitable for decentralized markets, actively supporting system vendors and providing a large number of services. Human intensive business projects are not suitable for European and American companies, but more suitable for us. For example, in the domestic market, if a product can ship 3 million pieces, the company will do it, while foreign companies cannot do it.

3. Build a "new hometown" for international elite talents and fully leverage the advantages of overseas returnees

Overseas returnees have conducted a lot of advanced technology development research abroad and have industry experience in some top companies around the world. After returning to China, they can easily succeed in developing and applying products that are in high demand. The research and development of the integrated circuit industry is afraid of directional errors and low-level duplication, and overseas returnees know how to succeed.

The typical model of Shanghai's integrated circuit industry development, which includes a team of returning talents, overseas work experience, preferential policy support, and venture capital, is particularly evident in Zhangjiang High tech Park. However, due to the lag of international community construction, restrictions of registered residence policy, lack of international competitiveness of individual income tax policy and other reasons, Zhangjiang still has not become an open and international high-tech park for overseas senior talents to settle down. The atmosphere of international students' short-term plans and "bird watching" activities is strong, which is not conducive to the gathering of global high-level talents. To fully leverage the advantageous location of Zhangjiang and the comprehensive development of Pudong

The policy advantages of supporting reform pilot projects will transform the simple attraction of international students into the attraction of high-level talents such as international students and foreign elites. Through the construction of the Science City and the international adjustment of personal income tax rates, as well as the optimization of household registration policies, Shanghai's traditional "Shanghai style culture" will be leveraged to build Zhangjiang into a new hometown for talent gathering and living in peace and contentment from around the world, greatly enhancing Zhangjiang's international competitiveness in the competition for high-level talents.

4. Focus on accumulation and overcome the rush for quick success and instant benefits

The complexity of the design industry is high, requiring a stable team and deep accumulation. Accumulation is an insurmountable process of development. The development of China's integrated circuit industry is like playing Go. We cannot just compete for short-term gains, we need to compare who has the longest potential, not who has more opportunities.

The supply of talents, especially design talents, in the integrated power industry has long been a hot topic of concern in the industry. Many universities are eager for quick success in terms of majors, settings, and talent cultivation, and blindly follow the so-called social hotspots and academic alignment, resulting in students' basic comprehensive qualities and humanities literacy being insufficient, and their knowledge base being too narrow. In fact, many design companies generally reflect that their recruitment criteria for talents are not simply based on professional matching, but rather place more emphasis on basic knowledge and comprehensive qualities. They generally reflect that higher education institutions are too eager for quick success and instant benefits.

5. Promote cooperation between enterprises and industrial chain cooperation

There are few horizontal connections between domestic enterprises, and outsourcing is just beginning. Basically, every design company has its own chips and is undergoing comprehensive development. These factors have all limited the rapid development of enterprises. We should fully utilize the solutions provided by some enterprises in South China for foreign markets, so that end customers can directly apply the company's products to the original solutions. In addition, design companies need to form close strategic partnerships with solution providers, distributors, and system vendors.

6. Abandon the idealized model of industry university research cooperation

The integration of industry, academia and research has always been regarded as a good way to promote the development of high-tech industries, but field research results have exposed people's unrealistic fantasies in this regard. The numerous design companies surveyed by the author do not have any expectations for universities to help with product development. The company's project requires fast progress, but there is a time issue with cooperation; Universities generally do not have the resources to enable factories to make more efficient use of factory space, nor are they suitable for the use of research and development centers. The newly developed air cooling system reduces reliance on external facilities and can be installed and set up at any location, while continuing to support various T2000 modules that comply with STC standards to meet various testing needs [2].

Other information

broadcast

edit

After the invention and mass production of transistors, various solid-state semiconductor components such as diodes and transistors were widely used, replacing the function and role of vacuum tubes in circuits. In the mid to late 20th century, advances in semiconductor manufacturing technology made integrated circuits possible. Compared to manually assembling circuits using individual discrete electronic components, integrated circuits can integrate a large number of microcrystals into a small chip, which is a huge advancement. The scale production capacity, reliability, and modular approach to circuit design of integrated circuits ensure the rapid adoption of standardized ICs instead of designing discrete transistors.

IC has two main advantages for discrete transistors: cost and performance. The low cost is due to the fact that the chip prints all components as a unit through photolithography technology, rather than producing only one transistor at a time. High performance is due to the fast switching of components, which consume less energy because the components are small and close to each other. In 2006, the chip area increased from a few square millimeters to 350mm ², with one million transistors per mm ².

The first prototype of an integrated circuit was completed by Jack Kilby in 1958, which included a bipolar transistor, three resistors, and a capacitor.

According to the number of microelectronic devices integrated on a chip, integrated circuits can be divided into the following categories:

1. Small scale integrated circuits

SSI's full English name is Small Scale Integration, with less than 10 logic gates or less than 100 transistors.

2. Medium scale integrated circuits

The full English name of MSI is Medium Scale Integration, with 11-100 logic gates or 101-1k transistors.

3. Large scale integrated circuits

The full English name of LSI is Large Scale Integration, with 101-1k logic gates or 1001-10k transistors.

4. Ultra Large Scale Integrated Circuits

The full name of VLSI in English is Very Large Scale Integration, with 1001-10k logic gates or 10001-100k transistors.

5. Very Large Scale Integrated Circuits

The full English name of ULSI is Ultra Large Scale Integration, with 10001-1M logic gates or 100001-10M transistors.

The full English name of GLSI is Giga Scale Integration, with more than 1000001 logic gates or more than 10000001 transistors.

According to the different signal processing, it can be divided into analog integrated circuits, digital integrated circuits, and mixed signal integrated circuits that combine analog and digital.

Development of Integrated Circuits

Integrated circuits are the 'cores' of microprocessors or multi-core processors that can control everything from computers to mobile phones to digital microwave ovens. Memory and ASIC are examples of other integrated circuit families that are crucial for modern information society. Although the cost of designing and developing a complex integrated circuit is very high, the cost of each IC is minimized when dispersed across typically millions of products. The performance of ICs is high because their small size brings short paths, allowing low-power logic circuits to be applied at fast switching speeds.

In recent years, ICs have continued to develop towards smaller external dimensions, allowing each chip to encapsulate more circuits. This increases the capacity per unit area, which can reduce costs and increase functionality - according to Moore's Law, the number of transistors in integrated circuits doubles every two years. In short, with the reduction of external dimensions, almost all indicators have improved - unit cost and switch power consumption have decreased, and speed has increased. However, ICs that integrate nanoscale devices are not without problems, mainly due to leakage current. Therefore, the increase in speed and power consumption for end-users is very significant, and manufacturers face a sharp challenge of using better geometry. This process and the expected progress in the coming years are well described in the International Technology Roadmap for Semiconductors (ITRS).

More and more circuits are appearing in the hands of designers in the form of integrated chips, leading to a trend towards miniaturization and high-speed development of electronic circuits. More and more applications have transformed from complex analog circuits to simple digital logic integrated circuits.

In 2022, a proposal was put forward to promote the sustainable development of China's integrated circuit industry chain: the integrated circuit industry is a strategic, fundamental, and leading industry for national economic and social development. The shortcomings and deficiencies in its entire industry chain have become one of the key factors restricting the high-quality development of China's digital economy and affecting the overall national strength enhancement. At present, China's integrated circuit industry is being suppressed and the shortage of mid to low end production capacity is becoming increasingly severe, and there are still some urgent problems that need to be solved. One is the coexistence of weak capabilities and insufficient market in domestic chip companies. The second is the comprehensive blockade of advanced technology equipment in China's integrated circuit industry by the United States and the West, forming new industrial barriers. Thirdly, there is currently a shortage of talent in China's integrated circuit industry, and the training of process research and development personnel lacks the support of "production lines". Therefore, it is recommended to leverage the advantages of the new national system and continue to support the development of the integrated circuit industry. Continue and expand major national science and technology projects, concentrate efforts on tackling core difficulties. Support suite applications and gradually achieve domestic substitution. Expand new application areas. Increase the scale of industrial funds and extend the investment cycle. The second is to adhere to the long-term layout of industries and deepen the reform of talent cultivation. We need to both 'fill gaps' and' lengthen gaps'. Continuously increasing the training of scientific researchers and ensuring investment in basic research personnel to solidify the talent foundation. The third is to adhere to high-level opening up to the outside world, expand and create emerging markets. Actively explore emerging markets related to integrated circuits in the future and support Chinese integrated circuit enterprises to go global. [3]

The popularization of IC

Only in the second half century of its development, integrated circuits became ubiquitous, and computers, mobile phones, and other digital appliances became a part of modern society. This is because modern computing, communication, manufacturing and transportation systems, including the Internet, all depend on the existence of integrated circuits. Even many scholars believe that the digital revolution brought about by integrated circuits is the most important event in human history.

Classification of ICs

There are many classification methods for integrated circuits. According to whether the circuit belongs to analog or digital, it can be divided into analog integrated circuits, digital integrated circuits, and mixed signal integrated circuits (analog and digital on one chip).

Digital integrated circuits can contain anything, ranging from thousands to millions of logic gates, flip flops, multitaskers, and other circuits on a few square millimeters. The small size of these circuits allows for higher speed, lower power consumption, and reduced manufacturing costs compared to board level integration. These digital ICs, represented by microprocessors, digital signal processors (DSPs), and microcontrollers, use binary in their operation to process 1 and 0 signals.

Analog integrated circuits include sensors, power control circuits, and operational amplifiers, which process analog signals. Complete functions such as amplification, filtering, demodulation, and frequency mixing. By using simulated integrated circuits designed by experts with good characteristics, the burden on circuit designers has been reduced