Semiconductor slicer MC10i

The MC10i intelligent micro cracking system in the SELA series has the ability to spray liquid nitrogen during the cracking process, making it a new leading solution for obtaining high-quality, high-precision, high-throughput crystal materials and SEM sample preparation. It is equipped with a unique Te LN2 spraying capability, which can eliminate the stretching and drawing phenomenon caused by metal or other materials during the cracking process to ensure the best quality of the cross-section.

MC10i provides customers with a comprehensive cracking solution, featuring SELA's advanced micro cutting capability and complete cutting technology.

The MC10i desktop system achieves semi-automatic, reliable, and rapid cutting of wafer and die sample cross-sections. A dedicated software system can achieve precise positioning and control of target components, and the cracked samples can be directly used for subsequent inspection and analysis.