OMRON High Speed Automated 3D-CT Inspection System (AXI)

NegotiableUpdate on 01/13

Model

Nature of the Manufacturer: Producers

Product Category

Place of Origin

Online Consult

Overview

As a high-speed and high-quality inspection device using full 3D-CT, VT-X750 is widely used for non-destructive inspection of 5G infrastructure/modules and on-board electrical components, as well as in aerospace, industrial equipment, semiconductor and other fields. In recent years, this model has been used for inspecting power devices such as IGBT and MOSFET in electric vehicles, internal bubbles in soldering of mechatronics products, and soldering filling of through-hole connectors.

Product Details

OMRON 高速自动化3D-CT检测系统(AXI)

As a fully adoptedThe high-speed and high-quality inspection device of 3D-CT, VT-X750, is widely used for non-destructive inspection of 5G infrastructure/modules and on-board electrical components, as well as aerospace and industrial applicationsIndustries such as equipment and semiconductors. In recent years, this model has been used for electric vehiclesInternal bubbles and through holes in the solder of power devices such as IGBT and MOSFET, as well as mechatronics productsInspection of solder filling and other related aspects of connectors

Applicable products: OMRON 高速自动化3D-CT检测系统(AXI)

BGA/CSPInsert componentsSOP/QFPTransistorsR/CChips, bottom electrode componentsQFNPower modulePOPThepress-fitConnectors, etc

Inspection items:

Bubbles, open soldering, non wetting, solder quantity, offset, bridging, solder crawling, through-hole solder filling, solder beads, etc(Can be selected based on the inspection object)

core value:

✓ OnlineFull board high-speed scanning

Industry leaders3D-CT technology, realizing whole board components (including BGA/connectors/chips, etc.)online100% non-destructive testing, with a speed comparable to previous generation models（VT-X700）More than twice→Full inspection of M-sized substrates only takes minutes (including 2000+pins BGA/SiP)

OMRON 高速自动化3D-CT检测系统(AXI) ✓Visualization of solder strength

Du HomeThe 3D-CT algorithm accurately quantifies the shape of solder, achieving:

•Solder bubbles/Virtual soldering/bridging/tin crawling, etcMicron level defect detection

•Quick quality verification during production switching to eliminate design constraints

✓AI intelligent assistance system	✓ Safety zero stop line guarantee
• Automatic judgmentOK/NG (AI+quantitative double standard)	Radiation reduction technology (standard filter)+High speed scanning
Intelligent generation detection program（Automatic Conversion of CAD Data	• Component radiation simulator predicts risks
• Optimal parameter simulation (beat)/Radiation adaptive optimization)	Global remote monitoring support

OMRON 高速自动化3D-CT检测系统(AXI)

Technical specifications:

project		content
model		VT-X750		VT-X750-XL
type		V3-H	V3-C	V2-H
Shooting resolution		6~30μ m adjustable	6~30μ m adjustable	10~30μ m adjustable
Object substrate	Substrate size	50×50～610×515mm Thickness0.4～5.0mm (resolution3μmtime0.4～3.0mm)		100×50～1200×610mm Thickness0.4～15.0mm
	Substrate weight	4.0kgBelow8.0kgbelow(※ Options)		15kgbelow
	warp	2.0mmbelow(resolution3μmtime1.0mmbelow)		3.0 mmbelow