Plasma enhanced atomic layer deposition equipment (ALD) - TFS200

Beneq TFS 200 is designed specifically for academic and corporate research and development, and is a versatile atomic layer deposition (ALD) platform that provides excellent performance in true ALD modeyueThe quality of the film.

The modular architecture of this system allows for extensive upgrades, ensuring that it can evolve according to your research needs, no matter how complex. Beneq TFS 200 supports deposition on various substrates, including wafers, planar objects, porous materials, and complex 3D structures with high aspect ratio (HAR) functionality, enabling precise coating even in KE etching applications.

of PEALD function

The Beneq TFS 200 comes standard with direct and remote plasma enhanced atomic layer deposition (PEALD). By utilizing a capacitance coupled plasma (CCP) source (industry standard), it facilitates a smooth transition from research and development to production environments. This system supports PEALD process on substrates up to 200mm in size.

Optimized for efficiency and accuracy

• PureThe ALD mode has been optimized to achieve fast and precise thin film growth

•HAR functionality is suitable for challenging structures such as through holes and porous substrates

The hot wall reaction chamber in the cold wall vacuum chamber can achieve uniform heat distribution and rapid chamber replacement

• Comprehensive upgrade options to meet advanced research needs

Loading locks, box loaders, and glove boxes for rapid transfer of substrates in a controlled atmosphere

Technical information:

Example application:

• Used to block applications Al2 O3 ALD

• In semiconductor applications HfO2, SiO2, and SiN ALD

• Used for photovoltaic cells SnO2 ALD

• Used for superconductor applications TiN and NbN ALD modules