Semi automatic wafer bonding machine

SUME BW510 is a semi-automatic wafer bonding machine used for research and development or small batch production. It has excellent pressure and temperature uniformity, a unique structural design to ensure that the bonding pressure plate is relatively horizontal, an excellent vacuum system and chamber design, convenient and concise menu editing, equipment status monitoring, and safety protection functions. SUMEBW510 is compatible with most product circle sizes, with an open cavity design for easy maintenance and conversion to different specifications. It has a small footprint and complete functions.

Semi automatic wafer bonding machine

Equipment advantages:
High vacuum bonding chamber; Faster heating and vacuuming to increase production capacity;

Single chip up to 200mm product;

Compatible with experiments and production;
The program runs automatically;
Better cost control.

SUMEBW510 is a highly flexible bonding equipment that can process single chips up to 200mm wafer size. The equipment supports common wafer bonding processes such as eutectic bonding, metal bonding, adhesive bonding, direct bonding, and other process requirements. The easy-to-use bonding chamber design allows for quick tool replacement and easy reprocessing of other size processes in less than 5 minutes, making it ideal for small batch production in laboratories, research institutes, or companies.

Semi automatic wafer bonding machine