Scanning electron microscopy liquid thermoelectric in-situ system

Our Advantages

high resolution

MEMS microfabrication processMake the thickness of the silicon nitride film in the window area of the electrochemical chipThe thinnest can reach 10nmThis greatly reduces interference with the electron beam, and the liquid phase environment can achieve nanometer level resolution.

高安全性

1. Other common brands of liquid sample rods on the market, due to the limitations of their own liquid pool chip design, can only use the huge pressure generated by the liquid pump to push a large flow of liquid through the sample stage and the peripheral area of the chip, which poses a safety hazard of a large amount of liquid leakage. The liquid mainly enters the nanopores in the middle of the chip through diffusion effect, and there is no real flow rate control in the observation window of the chip.

2. Using nanofluidic technology, fluid differential control is achieved through a piezoelectric microcontroller system to achieve nanoupgraded microfluidic transport,In situ nanofluidic systemThe redundant liquid volume in the sample rod is only in microliters, effectively ensuring the safety of the electron microscope.

3. Adopting polymer membrane surface contact sealing technology, compared to O-ring sealing, it increases the sealing contact area and effectively reduces the risk of leakage.

4. Adopting ultra-high temperature coating technology, the silicon nitride film in the chip window area has the advantages of high temperature resistance, low stress resistance, pressure resistance, corrosion resistance, and radiation resistance.

Excellent thermal performance

1. High precision infrared temperature measurement and calibration, micrometer level high-resolution thermal field measurement and calibration to ensure temperature accuracy.

3. Ultra high frequency temperature control method eliminates the influence of wires and contact resistance, and measures temperature and electrical parameters more accurately.

3. High stability precious metal heating wire (non ceramic material) is used, which is both a thermal conductive material and a thermal sensitive material. Its resistance has a good linear relationship with temperature. The heating zone covers the entire observation area, and the heating and cooling rates are fast. The thermal field is stable and uniform, and the temperature fluctuation in a stable state is ≤± 0.1 ℃.

4. Adopting a closed-loop high-frequency dynamic control and feedback environmental temperature control method, high-frequency feedback control eliminates errors, and the temperature control accuracy is ± 0.01 ℃.

5. Multi level composite heating MEMS chip design, controlling thermal diffusion during heating process, greatly suppressing thermal drift during heating process, ensuring efficient observation of experiments.

Intelligent software and automation equipment

1. Human machine separation, software remote control of experimental conditions, automatic recording of experimental details throughout the process for easy summarization and review.

2. Customize the program's heating curve. It is possible to define a heating program with more than 10 steps and a constant temperature time. At the same time, the target temperature and time can be manually controlled. If temperature and constant temperature are required during the heating process, the experimental plan can be adjusted immediately to improve experimental efficiency.

3. Built in absolute temperature calibration program, each chip can re fit and calibrate the curve according to the change in resistance value during temperature control, ensuring the accuracy of temperature measurement and the reproducibility and reliability of heating experiments.

4. The entire process is equipped with precision automation equipment to assist manual operation and improve experimental efficiency.

Team Advantage

1. The team leader participated in the research and development of the in-situ liquid phase development and improved the method from the early stage.

2. Independently design in-situ chips, master chip core processes, and possess multiple chip patents.

More than 20 members of the team are engaged in in-situ liquid-phase research and can provide in-situ experimental technical support for multiple research directions.

Technical Specifications

Application Cases

Electrochemical dissolution

Electrochemical deposition