Scanning Electron Microscope High Temperature In Situ System - Basic Edition

NegotiableUpdate on 12/14

Model

Nature of the Manufacturer: Producers

Product Category

Place of Origin

Online Consult

Overview

The scanning electron microscope heating in-situ system applies thermal field control to the sample through MEMS chips, and constructs an automatic control and feedback measurement system for the thermal field in the in-situ sample stage. Combined with various testing modes such as EDS and EBSD, it realizes real-time and dynamic monitoring of key information such as microstructure, phase transition, elemental valence state, microscopic stress, atomic level structure and composition evolution at the surface/interface of the sample under vacuum environment with temperature changes at the nanoscale or even atomic level.

Product Details

Our Advantages

High resolution and reliability

1．MEMS microfabrication processThe thickness of the silicon nitride film in the window area of the heating chip can reach up to 10nm, which can achieve the maximum resolution of scanning electron microscopy.

Excellent thermal performance

1．High precision infrared temperature measurement calibrationMicro scale high-resolution thermal field measurement and calibration to ensure temperature accuracy.

2. Ultra high frequency temperature control method eliminates the influence of wires and contact resistance, and measures temperature and electrical parameters more accurately.

3. High stability precious metal heating wire (non ceramic material) is used, which is both a thermal conductive material and a thermal sensitive material. Its resistance has a good linear relationship with temperature, and the heating zone covers the entire observation area. The heating and cooling rate is fast, and the thermal field is stable and uniform, with temperature fluctuations of ± 1 ℃ in a stable state.

4. Adopting a closed-loop high-frequency dynamic control and feedback environmental temperature control method, high-frequency feedback control eliminates errors, and the temperature control accuracy is ± 1 ℃.

5. Multi level composite heating MEMS chip design, controlling thermal diffusion during heating process, greatly suppressing thermal drift during heating process, ensuring efficient observation of experiments.

6. The heating wire is coated with silicon nitride on the outside, which does not react with the sample, ensuring the accuracy of the experiment.

Technical Specifications

category	project	parameter
Basic Parameters	Platform material	High strength titanium alloy
	resolution	Extreme resolution of scanning electron microscopy
	Applicable electron microscope	ZEISS
	EDS/EBSD	support

Application Cases

Synthetic scheme for thepreparation of ZIF-67 crystalsand GC

SEM images

图片13.png 图片14.png

ZIF-67 after heated