RSS-310-SC Compact Sintering Reflow Soldering System

RSS-310-SC Compact Reflow Soldering System

application

• Reflow soldering process (without solder)

• Lead free and void free soldering

• Can be operated with inert gas, argon gas, forming gas, formic acid (depending on the model)

characteristic

• Accurate heating rate and rapid cooling rate

• temperature uniformity

• One gas pipeline (mass flow controller), compatible with 5 standard liters/minute of nitrogen gas

• Data recording (Universal Serial Bus, Ethernet)

• The hot plate is heated by a heating rod and cooled down through active cooling (dissipating heat to the chassis)

• 50 programs, each containing 50 steps

• compact footprint

Product Overview

• Desktop reflow soldering systemSpecially designed for laboratories and small-scale production

• Programmable temperature curve: Supports precise control of complex welding processes

• Process data monitoring and readingReal time monitoring of key parameters

• Multi atmosphere process supportCompatible with various process environments such as inert gases and reactive gases

• compact designSmall size, light weight, suitable for laboratory environment

process control

• temperature curve

• Process gas flow rate

• Cooling water level status

• Pressure value and status

cooling system

• Water-cooled hot plateExternal water cooling system is required (closed-loop water cooling cycle system is recommended)

• Efficient thermal managementEnsure rapid cooling rate and process stability

application field

• R&D testingResearch and development validation of new materials and processes

• prototypingQuickly produce high-precision welding prototypes

• Environmental StudiesSimulate welding process under special atmosphere

• small batch productionSuitable for small batch manufacturing of electronic devices

process gas

• Standard ConfigurationSupport process gases such as nitrogen, oxygen, and molding gas

• Optional configurationFormic acid module (requires specific model support) to achieve cavity free welding effect

• Sealed chamber designEasy to clean and maintain, reducing the risk of cross contamination

flow control

• standard configuration1 Mass Flow Controller (MFC) for standard process gases

• optional extensionIndependent MFC controlled formic acid module or shared gas pipeline configuration

vacuum system

• ultimate vacuumUp to 10 ⁻ ³ hPa

• Pump configurationProvide multiple options such as diaphragm pumps, chemical corrosion-resistant pumps (recommended for formic acid process), rotary vane pumps, etc

temperature distribution

• maximum temperature：400°C

• heating rateUp to 120 K/min (depending on the specific model)

• 降温速率Maximum 90 K/min (range from 200 ° C to 50 ° C)

• temperature uniformityExcellent temperature distribution on the surface of the hot plate ensures consistent welding quality

Programming control

• 7-inch touch screen: Intuitive user interface, supports local programming

• Program storageBuilt in 50 programs, each program supports 50 steps

• data expansionSupport unlimited expansion of program libraries through external storage devices

Typical application scenarios

• Development of Welding Process for New Electronic Materials

• High precision sensor packaging

• Manufacturing of Micro Electro Mechanical Systems (MEMS) Devices

• Precision Welding of Aerospace Electronic Components

• Research on cutting-edge material connections in scientific research institutions