P170 fully automatic wafer probe profilometer/stair step meter

P-170 is a cassette to cassette probe profilometer that combines the measurement performance of the industry-leading P-17 desktop system with the production validated HRP ®- Combined with a mechanical transmission arm of 260. This combination provides an extremely low cost of ownership for mechanical transfer arm systems, suitable for semiconductor, compound semiconductor, and related industries. P-170 can perform 2D and 3D measurements of step height, roughness, curvature, and stress, with a scanning capability of up to 200mm without the need for image stitching.

This system combines UltraLite ® Sensors, constant force control, and ultra flat scanning platform provide excellent measurement stability. The program settings are simple and fast through functions such as point and click platform control, top and side view optical systems, and high-resolution cameras with optical zoom. P-170 is equipped with various filters, leveling, and analysis algorithms for quantifying surface morphology, and can support 2D or 3D measurements. And achieve fully automatic measurement through pattern recognition, sorting, and feature detection.

2、 Function

Equipment features

·Step height: several nanometers to 1000 μ m

·Micro force constant force control: 0.03 to 50mg

·Sample full diameter scanning, no need for image stitching

·Video: 5-megapixel high-resolution color camera

·Arc correction: Eliminating errors caused by the arc-shaped motion of the probe

·Software: Simple and easy-to-use software interface

·Production capacity: Fully automated through sequencing, pattern recognition, and SECS/GEM

·Wafer mechanical transfer arm: automatically loads 75mm to 200mm opaque (such as silicon) and transparent (such as sapphire) samples

Main applications

·Step height: 2D and 3D step height

·Texture: 2D and 3D roughness and waviness

·Shape: 2D and 3D warping and shaping

·Stress: 2D and 3D thin film stress

·Defect re inspection: 2D and 3D defect surface morphology

Industrial applications

·Semiconductor

·Compound semiconductor

·LED: Light Emitting Diode

·MEMS: Micro Electro Mechanical Systems

·Data storage

·Car

3、 Application Cases

·Step height

P-170 can provide measurements of 2D and 3D step heights ranging from nanoscale to 1000 μ m. This enables quantification in etching, sputtering, SIMS， Materials deposited or removed during deposition, spin coating, CMP, and other processes. P-170 has constant force control function, which can dynamically adjust and apply the same micro force regardless of the step height. This ensures good measurement stability and the ability to accurately measure soft materials such as photoresist.

·Texture: roughness and waviness

P-170 provides 2D and 3D texture measurement and quantification of sample roughness and waviness. The software filter function divides the measured values into roughness and waviness parts, and calculates parameters such as root mean square (RMS) roughness.

·Appearance: Warping and Shape

P-170 can measure the 2D shape or curvature of surfaces. This includes measuring wafer warpage, such as during multi-layer deposition in semiconductor or compound semiconductor device production, where layer to layer mismatch is the cause of this warpage. P-170 can also quantify the height and curvature radius of structures, including lenses.

·Stress: 2D and 3D thin film stress

P-170 is capable of measuring the stress generated during the production of semiconductor or compound semiconductor devices containing multiple process layers. Use a stress chuck to support the sample in a neutral position and accurately measure the sample warpage. Then, by applying the Stoney equation, stress can be calculated using shape changes such as thin film deposition processes. 2D stress is measured through a single scan on a sample with a diameter of up to 200mm, without the need for image stitching. The measurement of 3D stress adopts multiple 2D scans and combines the rotation of the θ platform between scans to measure the entire sample surface.

·Defect re inspection

Defect review is used to measure the morphology of defects such as scratch depth. Defect detection equipment identifies defects and writes their location coordinates into KLARF files. The 'Defect Re inspection' function reads KLARF files, aligns samples, and allows users to select defects for 2D or 3D measurement.