Lens 3D printing machine

EVG 520HE hot stamping systemThe universal production validation hot embossing system can meet high requirements.

Technical data

The EVG520 HE semi-automatic hot embossing system is designed for high-precision embossing of thermoplastic substrates. EVG's production validated system can accept substrates with diameters up to 200 mm and is compatible with standard semiconductor manufacturing technologies. The hot embossing system is equipped with a universal embossing chamber, high vacuum and high contact force functions, and manages the entire range of polymers suitable for hot embossing. Combining high aspect ratio embossing and multiple release options, it provides many processes for high-quality pattern transfer and nanometer resolution.

feature

Hot embossing and nanoimprinting applications for polymer substrates and spin coated polymers

Automated embossing process

EVG's proprietary independent alignment process for optical alignment imprinting and stamping

Pneumatic embossing option

Software controlled process execution

Technical data

Heater size 150mm 200mm

Large substrate size 150mm 200mm

Small substrate size single chip 100mm

Large contact forces of 10, 20, 60, and 100 kN

High temperature: Standard: 350 ° C; Optional: 550 ° C

Adhesive Chuck System/Alignment System: 150mm Heater: EVG ® 610， EVG ® 620， EVG ® six thousand and two hundred

200mm heater: EVG ® 6200， MBA300，SmartView ® NT

Vacuum: Standard: 0.1 millibars; Optional: 0.00001 mbar