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Room 707, Aiqian Building, 599 Lingling Road, Xuhui District, Shanghai, China
Product Categories
- Z-series stereomicroscope Leica Z6 APO
- F30 online film thickness tester
- F60 Fully Automatic Film Thickness Tester
- Diener NANO plasma cleaning machine
- Vista-IR High Resolution Nanoinfrared Imaging and Spectroscopy System
- LF-2000 Integrated In Situ Nanomanipulation Machine
- 6-inch nanoimprint machine NIL-150
- Passive isolation table GWA-TM
- High precision nano stretching system Nano UTM T150
- RSA5000 series spectrum analyzer
- TTR500 Series Vector Network Analyzer (VNA)
- MTA02 Micro Force Displacement Test Control System
- PA1000 power analyzer
- TS2000 automatic probe station
- TS200 8-inch manual probe station
- F3 Single Point Film Thickness Tester
- Candela CS920 Surface Defect Detector
- P170 fully automatic wafer probe profilometer/stair step meter
- NX Hivac High Vacuum Atomic Force Microscope
- NX-PTR fully automatic online detection atomic force microscope
- NX-HDM fully automatic defect detection atomic force microscope
- P17 automatic wafer probe profilometer/stair step meter
- NX Wafer Fully Automated Wafer Inspection Atomic Force Microscope
- NX-3DM Rotating Fully Automatic Atomic Force Microscope
- Nano observer electrical atomic force microscope
- EM-AFM electron microscope in situ atomic force microscope
- Cathodic Fluorescence Imaging Spectral Detection System
- SERS chip substrate
- Multi functional maskless laser direct writing
- Optical surface defect analyzer
- Maskless laser direct writing
- Explorer Electron Beam, Magnetron, Thermal Evaporation Thin Film Deposition
- DV-502 Thermal Evaporation Thin Film Deposition
- Desktop Pro Thin Film Deposition - Magnetron Sputtering
- BenchTop Turbo Thermal Evaporation and Sample Preparation
- Desk V Thin Film Deposition Solution
- Hyperspectral microscope
- Freeform Surface 3D Shape Tester
- Wafer warpage stress measuring instrument
- Internal stress detector
- Semi automatic wafer bonding machine
- proximity aligner
- Array pressure sensing system
- Atomic layer deposition system ALD products
- Electron microscope sample cleaning machine
- CMP20 electrochemical mechanical polishing machine
- Laser interference lithography machine
- VITA reactive ion etching machine (vertical chamber)
- COWIN High Throughput Integrated Plasma Reaction Ion Etching Cleaning System
- LAVIDA Paraxylene Coating Equipment
- Co series desktop plasma etching machine cleaning machine
- CLONE dual-mode plasma etching machine cleaning machine
- Liquid particle size analyzer
- EzAFM portable atomic force microscope
- Laser sampling
- Precision glass cutting machine (desktop type)
- ADR low-temperature constant temperature dry mK system
- Liquid Particle Sizer - LPC
- High temperature 3D printer
- Block resistance tester
- S100 type digital source table
- NX12 Biological Atomic Force Microscope
- Zeta-388 automatic multi-mode optical profilometer
- TS200-HP high-power probe station
- Zeta-300 multi-mode optical profilometer
- TS2000-DP high-power probe station
- TS50 manual small probe station
- TS2500-RF Fully Automatic RF Probe Station
- TS3000 automatic probe station
- MicroXAM800 White Light Interferometer
- TS300 12 inch manual probe station
- MDO34 oscilloscope
- In situ AFM in SEM
- Pulse laser deposition system (PLD)
- Active Vibration Isolation Platform AMT
- Duramin-100 hardness tester
- 3-inch nanoimprint machine NIL75
- In situ automatic nanomanipulation system
- In situ MEMS chips and synchrotron radiation holders
- In SEM HT high-temperature in-situ nanoindentation instrument
- Duramin-4 hardness tester
- High temperature in-situ nanoindentation instrument
- Active isolation table ARISTT
- Active isolation table ARISMD
- Passive vibration isolation SOTOT
- Passive isolation table GWA-M
- Passive isolation table GWA-TO
- Active isolation table PMT
- Diener Pico plasma cleaning machine
- Diener FEMTO plasma cleaning machine
- FT-NMT04 Nano Mechanical Performance Testing System
- ACCUTOM-10/-100 cutting equipment
- X1 series digital adjustable drying cabinet
- EZ series stereomicroscope
- DM 4500P semi-automatic intelligent digital polarizing microscope
- Leica M Series Stereoscopic Microscope LeicaM165FC/205FA
- S series stereomicroscope
- Leica M Series Stereoscopic Microscope LeicaM125/165C/205C/205A
- DM750P professional polarizing microscope
- EUV/X-ray reflector
- X-ray Fresnel zone plate (FZP)
- Grating template
- MPI Titan RF Accessories
- GGB microwave probe
- Quantifoil porous mesh carrier
- GGB calibration standard sample
- Customized vibration isolation system
- Ion beam etching/deposition system
- Silicon nitride thin film window
- AFM substrate
- AFM probe
- MPI RF calibration substrate
- GGB active high impedance needle tip
- GGB DC probe
- Hole shaped template
- Prism coupler
- Duramin-40 hardness tester
- 4-inch nanoimprint machine NIL-100
- Leica room temperature ultra-thin slicer Leica EM UC7
- Film thickness measuring instrument
- BI-2500 desktop surface plasmon resonance analyzer
- Established Active Vibration Isolation Platform
- BI-4500 high-throughput fully automatic surface plasmon resonance analyzer
- TS150-HP high-power probe station
- Scanwave Scanning Microwave Near Field Impedance Microscope
- MVI scattering scanning near-field optical microscope
- TS150 6-inch manual probe station
- 4200A-SCS parameter analyzer
- F40 Microscopic Film Thickness Measuring Instrument
- Zeta20 multi-mode 3D optical profilometer
Shanghai Nateng Instrument Co., Ltd
LF-2000 Integrated In Situ Nanomanipulation Machine
NegotiableUpdate on 01/24
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Overview
LF-2000 Integrated In Situ Nanomanipulation Machine
Product Details
TNI LF-2000It is currently available on the market based onSEMThe most automated nanooperating system used under electron microscopy is also the only one that canSEMA nano operating system that provides repeatable positioning, low drift, and closed-loop motion control positioning under electron microscopy.LF-2000Mechanical measurement, electrical testing, nano object picking and assembly, fabrication of micro nano devices, and electrical measurement of nano electronic devices can be carried out under in-situ conditions.
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