HP8 mica board

Yangzhou Shunye Electric Co., Ltd. is a technology-based production enterprise established in 2015. The company is located in Baoying County, Liubao Industrial Concentration Zone, Jiangsu/Yangzhou, China.
Business scope: Yangzhou Shunye Electric Co., Ltd. specializes in producing insulation materials. The supplier code for China Aluminum Corporation is gys423102a. We provide high-quality products to many large domestic enterprise groups such as China Aluminum Corporation, China Aluminum Corporation, State Power Investment Corporation, Shanghai Electric Group, Pangang Group Co., Ltd., China Eastern Electric Group Co., Ltd., Southern Power Grid Corporation, Baoye Group, 22MCC, 7MCC, 17MCC, etc.

HP8 mica board It is a board or roll shaped insulation material made of high-quality muscovite paper or gold mica paper combined with non curing silicone resin, baked, pressed and wound (or reinforced with electrical alkali free glass fiber cloth on both sides). It has excellent bending strength and processing performance, high bending strength and toughness, and can be stamped into various shapes without delamination.

HP8 mica board Common issues that may arise during the production process:

1. Surface area glue (tree nitrile stains) occurs mainly due to the high solubility and volatile matter of the adhesive tape: low preheating temperature and insufficient time of the blank; low temperature during blank mold installation; Due to reasons such as excessive pressure after mold closure. Qualified adhesive tape should be used. When the soluble resin content and volatile matter of the tape are too high, the pre drying time should be appropriately extended to allow more volatile matter to escape. Generally, the pre drying temperature should not be lower than 100 ℃. When installing the mold, the temperature of the mold hole should be around 100 ℃, not too low or too high. After closing the mold, the pressure should be slow, which has a certain effect on solving the surface area adhesive problem

The main reason for the surface hemp holes is that the soluble resin content of the adhesive tape is too low, and the pressure after mold installation is too slow or the quality of the blank is insufficient. Qualified adhesive tape should be used. When the soluble resin content of the adhesive tape is found to be too low, the pre drying temperature should be lowered, the time should be appropriately shortened, the mold installation temperature should also be lower, and the pressure after mold closure should be faster. This has a certain effect on solving surface roughness caused by insufficient blank quality, and the quality should be supplemented

The main causes of cracking at the three ends and inside are the high content of soluble resin and volatile compounds in the adhesive tape. The pre drying temperature and time are unreasonable. For adhesive tapes with high content of soluble resin and volatile compounds, it is necessary to extend the pre drying time appropriately to remove more volatile compounds. However, if the pre drying time is too long, the resin will still crack even after being dried and solidified. It is necessary to analyze the reasons according to the specific situation and extend the pre drying time appropriately.

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