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Yangzhou Shunye Electric Co., Ltd

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    754974449@qq.com

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    Liubao Town Economic Development Zone, Baoying County, Yangzhou City

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Graphitic cathode insulation board

NegotiableUpdate on 02/18
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Overview

Graphitized cathode insulation board is suitable for high insulation structural components in mechanical, electrical, and electronic applications, with high mechanical and dielectric properties, good heat resistance, and moisture resistance. Heat resistance level F (155 degrees).

Product Details

Graphitized cathode insulation board, also known as epoxy glass fiber board, contains active epoxy groups in its molecular structure, which allows them to undergo cross-linking reactions with various types of curing agents to form insoluble and non melting high polymers with a three-dimensional network structure.


Product Features:

Epoxy board: Glass fiber cloth is bonded with epoxy resin and made by heating and pressing. It has high mechanical properties at medium temperatures and stable electrical properties under high humidity. Suitable for high insulation structural components used in machinery, electrical appliances, and electronics, with high mechanical and dielectric properties, good heat resistance, and moisture resistance. Heat resistance level F (155 degrees).

Specification thickness: 0.5-100mm

Under high temperature of 180 ℃, deformation may occur when the metal sheet is not heated together with other metals, which may cause deformation of the metal sheet.


Application features:

1. There are various forms. Various resin, curing agent, and modifier systems can almost meet the form requirements of various applications, ranging from extremely low viscosity to high melting point solids.

2. Curing is convenient. By using various curing agents, the epoxy resin system can be cured almost within the temperature range of 0-180 ℃.

3. Strong adhesion. The inherent polar hydroxyl and ether bonds in the molecular chain of epoxy resin give it high adhesion to various substances. The shrinkage of epoxy resin during curing is low, and the generated internal stress is small, which also helps to improve the adhesion strength.

4. Low contractility. The reaction between epoxy resin and the curing agent used is carried out through direct addition reaction or ring opening polymerization reaction of epoxy groups in resin molecules, without the release of water or other volatile by-products. Compared with unsaturated polyester resin and phenolic resin, they exhibit very low shrinkage (less than 2%) during the curing process.

5. Mechanical properties of graphitized cathode insulation board. The cured epoxy resin system has excellent mechanical properties.