Graphitic cathode epoxy resin insulation board

Epoxy board, also known as epoxy glass fiber board, epoxy phenolic laminated glass cloth board, model 3240, epoxy resin refers to high molecular weight compounds containing two or more epoxy groups in their molecules. Except for a few, their relative molecular weight is not high. The molecular structure of epoxy resin is characterized by the presence of active epoxy groups in the molecular chain, which can be located at the end, middle, or in a cyclic structure of the molecular chain. Due to the presence of active epoxy groups in their molecular structure, they can undergo cross-linking reactions with various types of curing agents to form insoluble and non melting polymers with a three-dimensional network structure.

Graphitic cathode epoxy resin insulation boardFiberglass cloth is bonded with epoxy resin and made under heating and pressure. The model is 3240, which has high mechanical properties at medium temperatures and stable electrical properties under high humidity. It can be processed into high insulation structural components for mechanical, electrical, and electronic applications, with high mechanical and dielectric properties, good heat resistance, and moisture resistance. The heat resistance level is F (155 degrees Celsius).

Specification thickness: 0.5-100mm

Regular size: 1000mm * 2000mm

Color: yellow

Heat deformation at a high temperature of 150 ℃ generally does not occur when heated together with other metals, which may cause deformation of the metal sheet.

1. Diverse forms: Various resin, curing agent, and modifier systems can almost meet the requirements of various applications for form, ranging from very low viscosity to high melting point solids.

2. Curing is convenient. By using various curing agents, the epoxy resin system can be cured almost within the temperature range of 0-180 ℃.

3. Strong adhesion. The presence of inherent hydroxyl and ether bonds in the molecular chain of epoxy resin enables it to have very high adhesion to various substances. The shrinkage of epoxy resin during curing is low, and the generated internal stress is small, which also helps to improve the adhesion strength.

4. Low contractility. The reaction between epoxy resin and the curing agent used is carried out through direct addition reaction or ring opening polymerization reaction of epoxy groups in resin molecules, without the release of water or other volatile by-products. Compared with unsaturated polyester resin and phenolic resin, they exhibit very low shrinkage (less than 2%) during the curing process.

5. Mechanical properties: The cured epoxy resin system has excellent mechanical properties.

Graphitic cathode epoxy resin insulation boardWidely used in places that require insulation, such as distribution cabinets, distribution rooms, and electric motors.