Candela CS920 Surface Defect Detector

The KLA Candela Optical Surface Defect Analyzer (OSA) is capable of advanced surface inspection of semiconductor and optoelectronic materials. The Candela series is capable of detecting opaque substrates such as Si, gallium arsenide, and indium phosphide, as well as transparent materials such as SiC, GaN, sapphire, and glass, making it a powerful tool for quality management and yield improvement in their manufacturing processes.

The Candela series adopts optical surface analysis (OSA) specialized technology, which can simultaneously measure scattering intensity, shape change, surface reflectivity, and phase transfer, and automatically detect and classify characteristic defects (DOI). OSA detection technology combines basic principles such as scattering measurement, elliptical polarization, reflection measurement, and optical shape analysis to non destructively detect residual foreign objects, surface and subsurface defects, shape changes, and uniformity of film thickness on the wafer surface. The Candela series has extremely high sensitivity and is used for new product development and production control, making it a highly cost-effective solution.

2、 Function

major function

1. Defect detection and classification

2. Defect analysis

3. Film thickness measurement

4. Surface roughness measurement

5. Thin film stress detection

FEATURES

A single machine solution that combines four optical detection methods in a single scan can achieve the most efficient automated defect detection and separation;

2. Automatically detect defects in LED materials to enhance substrate quality control, quickly identify the root cause of defects, and improve MOCVD quality control capabilities;

3. Meet various industrial requirements, including technologies such as high brightness light-emitting diodes (HBLEDs), high-power RF electronic devices, transparent glass substrates, etc;

4. More sensitive detection of defects that affect product yield in multiple semiconductor material systems.

5. Auto Defect Classification function

(Particle, Scratch, Pit, Bump, and Stain Detection)

6. Automatically generate defect mapping.

Technical capabilities

1. Defect size>0.3 μ m detected;

2. Maximum sample size: 8 inch wafer;

3. Defect classification with over 30 DOIs.

3、 Application Cases

1. Surface defect detection of transparent/non transparent materials

2. Defect control of MOCVD epitaxial growth film formation

3. Evaluation of PR film thickness uniformity

4. Evaluation of Clean Process Cleaning Effectiveness

5. Surface defect analysis of Wafer after CMP