Array pressure sensing system

Composed of a front-end flexible array microelectromechanical pressure sensor and a back-end software interface, the front-end sensor exhibits linear response changes according to the pressure it is subjected to. The higher the pressure, the higher the conductivity. The back-end software then presents and records the real-time pressure distribution on the contact surface to assist in effective adjustment and calibration of the equipment.

Compared to traditional induction paper, it is more cost-effective, reducing labor costs, improving accuracy, and real-time monitoring of production quality

The sensing system can be customized according to the specific situation of the customer's site, such as traditional mechanical equipment such as vacuum bonding, hot press roller laminating machine, tin ball flattening machine, mechanical loading and unloading, as well as crystal circle cleaning, water pressure distribution, brush pressure distribution, high-temperature bonding pressure detection, etc. in the semiconductor industry