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instrumentb2bExciting Review | The 6th Shenzhen International Semiconductor Exhibition


SEMI-e 6th Shenzhen International Semiconductor Exhibition



On June 26, 2024, the 6th SEMI-e Shenzhen International Semiconductor Exhibition opened at the Shenzhen International Convention and Exhibition Center. This exhibition has set up three pavilions and six major areas, gathering 815 exhibitors. On the first day of the exhibition, it was extremely popular.


As an advanced semiconductor equipment distributor, Daimei China is honored to participate in this exhibition.

This exhibition gathers numerous industry experts and elites, with exciting and rich content. Daimei had in-depth exchanges with experts, scholars, and entrepreneurs in the same industry, shared industry experience, and explored technological trends, benefiting greatly from it!

精彩回顾 | 第六届深圳国际半导体展




01

Exhibition Review

As a highly influential professional semiconductor exhibition platform in the industry, SEMI-e Shenzhen International Semiconductor Exhibition gathers 815 exhibitors, includingHu Tian TechnologyShanghai Huali, Zhonghuan, Tongfu Microelectronics, Huajin Semiconductor and other enterprises made a heavyweight appearance, showcasing new technologies and products in the semiconductor industry.


In addition to exciting exhibitions, multiple themed summits are being held. At events such as the "Semiconductor Industry Technology Summit," "Third Generation Semiconductor Industry Development Summit Technology Forum," and "2024 China Automotive Semiconductor Conference," representatives from Huawei, Tianke HedaNAURAExperts and executives from the 45th Research Institute of China Electronics Technology Group Corporation, Great Wall Motors, Dongfeng Corporation R&D Institute, Ziguang Tongchuang, Keyou Semiconductor, and Basic Semiconductor shared advanced semiconductor manufacturing and packaging technologies, as well as the latest application solutions for SiC

02

exhibition site

精彩回顾 | 第六届深圳国际半导体展

精彩回顾 | 第六届深圳国际半导体展

精彩回顾 | 第六届深圳国际半导体展

精彩回顾 | 第六届深圳国际半导体展

精彩回顾 | 第六届深圳国际半导体展

精彩回顾 | 第六届深圳国际半导体展

精彩回顾 | 第六届深圳国际半导体展

精彩回顾 | 第六届深圳国际半导体展

精彩回顾 | 第六届深圳国际半导体展


In recent years, third-generation semiconductor technology has gradually become the core driving force of the semiconductor industry. As a participant in this fieldWe have accumulated rich experience in various detection and measurement requirements for substrates and epitaxy. In order to better understand and meet customer needs, we have had extensive and in-depth exchanges with numerous clients, exploring the application and development directions of various detection and measurement technologies.

精彩回顾 | 第六届深圳国际半导体展

精彩回顾 | 第六届深圳国际半导体展

During the communication process, we focused on several key detection areas, including film thickness measurement, wafer thickness measurement, wafer morphology measurement, wafer bonding, photolithography, plasma cleaning, stress and sheet resistance measurement, etc. Every detection step is crucial and directly affects the performance and reliability of semiconductor devices.

Through these extensive and in-depth exchanges, we have not only deepened our understanding of customer needs, but also promoted the continuous optimization of our own technology and solutions. We are always committed to providing our customers with better servicesOur products and services contribute to the flourishing development of third-generation semiconductor technology.

Meanwhile, Daimei will continue to pay attention to and invest in the technology of semiconductor equipmentKeeping up with market trends to ensure progress in fierce market competition.

精彩回顾 | 第六届深圳国际半导体展





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