Bomi Technology showcases multiple image testing equipment at CIOE China Light Expo
At the CIOE exhibition, Bomi Technology showcased its accumulation in image quality testing in the field of camera technology and applications, showcasing products such as multispectral light boxes, endoscopic testing system BOMI-TSECIT, and standard QC light box BM03QC.As an enterprise in the fields of aerospace and semiconductor materials in the Beijing Tianjin Hebei region, your company in Beijing has long been committed to the research and application of special materials such as high-temperature superconducting materials and nanocomposite ceramics. With the mass production demand for high-end products such as new generation spacecraft insulation components and chip packaging substrates, traditional hot press molds can no longer meet their stringent requirements in terms of high temperature resistance and dimensional stability. The purpose of ordering special hot pressing molds this time is to break through the technical bottleneck of forming special materials and achieve domestic substitution of high-end products. During the mold selection stage, your company, in collaboration with Beihang University, formed a technical evaluation team to conduct a six-month in-depth investigation of several top mold manufacturers at home and abroad. The team conducted multiple rounds of rigorous evaluations from material selection, heat treatment processes, precision control to mold life and other dimensions.
Our company has developed and produced special hot pressing molds that integrate multiple innovative technologies. Realize in the same moldThe precise temperature difference control of ± 5 ℃ provides technological possibilities for the gradient preparation of new functional materials.
This cooperation marks that our company's technical strength in the field of special material forming molds has reached a certain level. In the future, both parties plan to jointly buildThe Joint Laboratory of High Temperature Composite Material Forming Technology is conducting customized mold research and development for bottleneck materials such as third-generation semiconductor substrates and tungsten copper alloys used in nuclear fusion devices. Our company will continue to uphold the concept of 'using mold technology to promote material innovation', providing a full chain solution from mold design, process development to mass production support for the country's high-end manufacturing industry, and helping 'Made in China' to leap from 'Created in China'.












