Zeiss in-situ high-throughput slicer

The Zeiss in-situ high-throughput slicer Volutome is an ultra-thin slicer used in Zeiss field emission scanning electron microscopy (FE-SEM) chambers for large-area continuous cutting and three-dimensional ultrastructural imaging of resin embedded biological samples.

Zeiss in-situ high-throughput slicerVolutome

Zeiss in-situ high-throughput slicerVolutome is an in chamber ultra-thin slicer used for Zeiss field emission scanning electron microscopy (FE-SEM), which is used for large-area continuous cutting and three-dimensional ultrastructural imaging of resin embedded biological samples. Zeiss Volutome uses the Volume BSD backscattered electron detector developed specifically for surface imaging, combined with a patented local charge compensation system*Fast imaging of samples under low acceleration voltage conditions, protecting your samples from electron beam damage and reducing the impact of charge effects, ensuring efficient and high-quality image acquisition for various types of samples. The design of the carrier based ultra-thin slicer combined with a stable Zeiss field emission scanning electron microscope ensures unmanned and automatic operation for over 72 hours, achieving large volume 3D image data acquisition. Zeiss Volutome is an integrated solution that covers the entire process of software and hardware products from sample cutting, imaging to image 3D processing and visualization. It provides you with more convenient, intelligent, and easy-to-use 3D imaging and analysis, helping you explore 3D ultrastructure in various life science research directions.

u Combine continuous slicing and imaging into one

u Using the high-efficiency and high-sensitivity backscatter detector Volume BSD developed specifically for body surface imaging

upatentLocal Charge Compensation System*Ensure that all types of samples can achieve high-quality image acquisition

u Simple modular workflow design, easy to operate

u A stable system ensures unmanned automatic operation for over 72 hours

u Synchronize image acquisition and image preprocessing to improve work efficiency

u A comprehensive solution covering the entire process from hardware to software

u Neuroscience: Neuroconnectomics, ultrastructural analysis related to neurodegenerative diseases, aging, and learning and memory

u Cell Biology: Statistical analysis of cells and organelles, comparing pathological and normal activity states, understanding basic cellular activity processes

u Botany: Research on the ultrastructural changes of healthy and diseased tissues, drug development, crop yield and food production, etc

u Organizational imaging: understanding the ultrastructural changes caused by diseases, metabolic changes, drug treatment, etc

Mouse brain tissue imaging and organelle segmentation were collected using GeminiSEM 460 with a pixel size of 3 nm. The samples were provided by Christel Genoud from the University of Lausanne in Switzerland.

Three dimensional reconstruction of mouse brain tissue neurons, made by Zeiss Arivis. The sample was provided by Christel Genoud from the University of Lausanne in Switzerland.

Three dimensional imaging and reconstruction of genetically modified stem cells were performed using Zeiss GeminiSEM 460, with a pixel size of 10 nm and a cutting thickness of 30 nm. The three-dimensional reconstruction was completed using Zeiss Arivis. The samples were provided by Alexandra Graff Meyer and Marc Buehler from the Friedrich Institute for Biomedical Research in Basel, Switzerland.

Three dimensional imaging of skeletal muscle was performed using Zeiss GeminiSEM 360, with a pixel size of 3 nm and a cutting thickness of 100 nm. The samples were provided by the Experimental Neurology Group at the University of Milan, Monza, Italy.

High resolution imaging of Arabidopsis leaves, collected using Zeiss GeminiSEM 460 with a pixel size of 6 nm. The sample was provided by Professor S. C. Zeeman from the Swiss Federal Institute of Technology Zurich.

*Protected by Patent U5953670482, DE1020121217751B4