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Guoguo Instrument Technology (Shanghai) Co., Ltd
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Wafer heating plate/module (customized)

NegotiableUpdate on 01/31
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Overview
Wafer heating plate and wafer heating module (customized) are very important in the semiconductor process, especially in some key processes such as wafer annealing, bonding, uniform bonding, etching, vapor deposition, etc. It can provide a stable temperature field environment and precise uniform temperature of the disc surface, ensuring the heating requirements of the wafer in various temperature zones, thereby achieving the manufacturing and research and development of semiconductor devices.
Product Details

Products related to temperature control technology, in-situ mechanics technology, etc., such as wafer heating systems, rapid annealing furnaces, high and low temperature test chambers, can provide personalized customization for customers.


Fruit Instrument Wafer Heating Module:It is very important in the semiconductor process, especially in some key processes such as wafer annealing, bonding, uniform bonding, etching, vapor deposition, etc. It can provide a stable temperature field environment and precise uniform temperature of the disk surface, ensuring the heating requirements of the wafer in various temperature zones, thereby achieving the manufacturing and research and development of semiconductor devices.

晶圆加热盘/模组(定制)

Wafer heating module (customized)Features:

• Temperature range: RT~600 ℃

• Temperature stability: ± 0.1 ℃

• Material: Aluminum alloy, stainless steel, Invar alloy, etc

High precision temperature control

Professional temperature control software

• Support customization


parameter

model

Wafer heating module (customized)

size

2/4/6/8/10/12 inches

temperature range

RT~600℃

temperature stability

±0.1℃

material

Aluminum alloy, stainless steel, Invar alloy, etc

flatness

≤10um, Up to 3um, depending on the material

Applicable Environment

Atmosphere/Vacuum

cooling system

Optional: water-cooled, air-cooled, etc

Bonding pressure

Optional: 0~100kN