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Brooke (Beijing) Technology Co., Ltd
TriboLab CMP Process and Material Characterization System
NegotiableUpdate on 07/10
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Overview
TriboLab CMP, a process and material characterization system, combines over 20 years of expertise in the CMP field to provide high-precision and highly repeatable solutions for process development. The system is capable of simulating a wide range of polishing conditions and has comprehensive measurement capabilities, including friction, acoustic emission, and surface temperature. Its flexible design allows for testing of various materials and sample sizes, making it particularly suitable for use in the research and development stage. It can achieve detailed characterization on small samples, saving costs and improving efficiency.
Product Details
TriboLab CMP Process and Material Characterization SystemBy leveraging its predecessor product (Bruker CP-4) with over 20 years of CMP expertise, it has brought a complete set of features to the TriboLab platform in the industry. The high precision and high repeatability generated by this equipment enable efficient identification, inspection, and continuous functional testing throughout the entire CMP process. TriboLab CMP is the only process development tool on the market that can provide a wide range of polishing pressures (0.05-50 psi), speeds (1 to 500 rpm), friction, acoustic emission, and surface temperature measurements, accurately and completely describing CMP processes and consumables.
A small-scale research and development professional system for CMPTriboLab CMP Process and Material Characterization System
Brooke's TriboLab CMP process and material characterization system is designed specifically for wafer polishing processes and is a reliable, flexible, and efficient desktop device.
Reproduce full-size wafer polishing process conditions without shutting down production equipment
Provide unparalleled measurement repeatability and detail detection
Allow testing on small samples, saving significant costs compared to full wafer testing
On board diagnostic system can better understand the polishing process
Provides more parameters for transient polishing processes than any other system on the market
Data can be collected from the moment of contact with the polishing disc until the entire testing process
Realize early process development decisions through more complete and detailed data
Flexible sample types, sizes, and installation configurations
Polish any flat material, almost any correction disc, any polishing solution, and any polishing pad can be used
Easy use of small-sized wafers below 100mm
Multiple samples can be installed simultaneously for more flexible testing
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