SiP module multi chip mounting machine

High precision hybrid multi chip mounting, suitable for one-way production of complex modules. Mainly used for various module mounting/inversion in the semiconductor industry, including optical modules, system in package (SIP), camera modules, etc. High precision linear motors are used for key axes to achieve fast beam response, precise control, and stable operation.

1. Adopting an efficient and high-precision motion platform, with a high module customization rate and greater flexibility

2. Large stroke welding head, up to 7 types of welding heads, 5 types of top pins, suitable for more intelligent module mounting needs

3. Fixed workbench with three-stage belt conveyor, capable of independently processing products at each stage

4. Visual technology uses CMOS cameras and RGB light sources to adapt to a wider range of substrate chips

5. Support device networking and SECS/GEM protocol