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Huayixing (Beijing) Technology Co., Ltd

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    cif_lab@163.com

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    18511111800

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    Room 301, International Enterprise Incubation Center, No. 7 Kexing Road, Fengtai District, Beijing

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RIE reactive ion etching machine

NegotiableUpdate on 01/04
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Overview
CIF launches RIE reactive ion etching machine, which uses RIE reactive ion induced excitation method to achieve microstructure etching of material surface anisotropy. It is particularly suitable for conducting research on dielectric etching, silicon etching, metal etching, and other related fields in universities, research institutes, microelectronics, and semiconductor enterprise laboratories. Low usage cost, high cost-effectiveness, easy maintenance, fast and efficient processing. The RIE reactive ion etching machine is suitable for performing RIE reactive ion etching on all substrates and complex geometric structures.
Product Details
CIF launches RIE reactive ion etching machine, which uses RIE reactive ion induced excitation method to achieve microstructure etching of material surface anisotropy. It is particularly suitable for conducting research on dielectric etching, silicon etching, metal etching, and other related fields in universities, research institutes, microelectronics, and semiconductor enterprise laboratories. Low usage cost, high cost-effectiveness, easy maintenance, fast and efficient processing.RIE reactive ion etching machineSuitable for RIE reaction ion etching on all substrates and complex geometric structures.
Specifically, it includes:
◆ Dielectric materials (SiO2, SiNx, etc.)
◆ picturesque की प्षियों की मौत के बाद सांभ झील से नमक.
III-V materials (GaAs, InP, GaN, etc.)
Sputtering metals (Au, Pt, Ti, Ta, W, etc.)
◆ Diamond like carbon (DLC)
Application fields:

RIE reactive ion etching machineMainly used for device research and manufacturing in fields such as microelectronic chips, solar cells, biochips, displays, optics, and communications.

Product Features

7-inch color touch screen with interactive operation interface in both Chinese and English, automatic control and monitoring of process parameter status, 20 formula programs, and traceable process data storage.

The PLC industrial computer controls the entire cleaning process, with two working modes: manual and automatic.

The vacuum chamber and full vacuum piping system adopt 316 stainless steel material, corrosion-resistant and pollution-free.

Adopting anti-corrosion digital flowmeter, Realize precise control of gas input. Standard dual gas delivery system, Optional multi gas optionsRoad gas delivery system, Can input oxygen, argon Gases such as nitrogen, carbon tetrafluoride, hydrogen, or mixed gases.

Adopting shower style porous air intake method to change uneven single hole air intakeUniform problem.

HEPA high-efficiency filtration, gas backfilling and purging to prevent secondary pollution.

Compliant with ergonomicsThe 60 degree tilt angle operation interface design is easy to operate and user-friendly.

Adopting a top mounted vacuum chamber, with an open top design and a downward pressure hinge openingClosing method.

Upward style360 degree horizontal sample collection and placement designIt conforms to the principles of human physiology and is more convenient to operate.

Effective processing area is large and can handle the maximum diameter154mm crystalline silicon wafer.

Security protection, cabin door open, automatic power off, machine operationPrompt to proceed and stop.