- Phone
-
Address
C320, Shuye Times Square, Lane 1388, Laohumin Road, Minhang District, Shanghai
Product Categories
Nano China Co., Ltd
Precision semiconductor cutting machine
NegotiableUpdate on 05/13
- Model
- Nature of the Manufacturer
- Producers
- Product Category
- Place of Origin
Overview
A precision semiconductor wafer cutting machine is a high-precision equipment that uses blades or lasers to cut wafers with high precision. It is mainly used for the post-processing of semiconductor chips, including fine processing such as wafer cutting, segmentation, or slotting. As key equipment for wafer cutting and WLP cutting in semiconductor post packaging testing, the quality and efficiency of cutting directly affect the packaging quality and production cost of chips.
Product Details
A wafer cutting machine is a high-precision equipment that uses blades or lasers to cut wafers with high precision. It is mainly used for the post-processing of semiconductor chips, including fine processing such as wafer cutting, segmentation, or slotting. As key equipment for wafer cutting and WLP cutting in semiconductor post packaging testing, the quality and efficiency of cutting directly affect the packaging quality and production cost of chips.
Precision semiconductor cutting machineThe setup of the MR 200 system software and hardware configuration can achieve high-precision marking, thereby achieving precise cutting of structured silicon wafers. MR 200 is a very powerful tool, especially important in the SEM sample preparation process of semiconductor technology. In addition, MR 200 is also suitable for cutting and separating small batches of chips, such as in laboratory applications.
Precision semiconductor cutting machineThe mechanical foundation device provides numerous options for adjusting the marking parameters. The high-quality zoom optical system can achieve continuous and stepless adjustment of magnification from 8x to 40x. Optical and mechanical components can be expanded through auxiliary modules to improve operational efficiency and human-machine interaction comfort. This module includes a camera system, an image processing system, and a workbench displacement measurement system.
Camera system:
This high-quality zoom microscope can achieve seamless switching between overview and detail images of the specimen surface. By fine-tuning the x/y stage, high-precision positioning of the specimen can be achieved. The starting point and working angle of the marked diamond can be adjusted, and the crosshair of the eyepiece is used to mark the starting point. The video system is optional, and after configuring this function, the surface condition of the wafer can be observed in real-time on the PC monitor.
Image processing system:
The high-quality zoom optical system can achieve continuous and stepless adjustment of magnification from 8x to 40x.
Workbench displacement measurement system:
Digital displacement measuring device, suitable for workbench positioning detection, with a range specification of 100mm/200mm. The measuring instrument can achieve high-precision positioning of the crystal frustum in the direction perpendicular to the cutting direction, and one of its main purposes is to accurately draw the grid.
Digital displacement measuring device, suitable for workbench positioning detection, with a range specification of 100mm
Digital displacement measuring device, suitable for workbench positioning detection, with a range specification of 200mm
Technical Specifications:
| main body | Extruded profile main frame |
| Size (BxTxH) | (400×800×600) mm |
| weight | 20kg |
| power system | Electromagnetic marking power system (switchable to pneumatic marking power system as needed, suitable for high marking pressure demand scenarios) |
| Marking diamond control | Foot switch control (up/down) |
| Cutting force | Adjustable from 10g to 120g (please consult for other requirements) |
| Width of marking groove | 5 μ m-10 μ m (depending on the marking force and material) |
| Blade speed | adjustable |
| Blade height | Adjustable for samples of different thicknesses |
| Blade working angle | adjustable |
| Marking particles | By vacuum extraction |
| microscope | High quality variable zoom, infinitely adjustable, magnification 8x-40x |
| eyepiece | Featuring hairline cross cutting lines, accurately marked based on edges, structural features, and reference marks |
| Optical system resolution | Better than 10 μ m (10x magnification) |
| wafer holder | Vacuum tray coated with Teflon, installed on X/Y sample stage, with a diameter of 200mm (optional 100mm) |
| Wafer fixture angle | Fine tune the angle of the wafer fixture using a spiral micrometer, with a resolution of 10 μ m (0.006 °) |
| Wafer fixture rotation | Equipped with an adjustable stop device, it can achieve precise 90 ° rotation without the need to turn off the vacuum |
| X-Y displacement worktable | Manual, effective travel 200x200mm, used for marking and rough positioning |
| 25mm micron screw | Used for precise positioning perpendicular to the line drawing direction |
| 10mm micron screw | Accurate positioning for marking direction |
| light source | LED ring light, supporting brightness adjustment and power supply |
| Minimum sample size | 10x10mm |
| wafer thickness | All standard thickness silicon wafers |
| Cutting material | Si, GaAs (other materials can be consulted) |
| video system |
Comes with image processing software, optional |
Optical system:
The high-quality zoom optical system can achieve stepless adjustment from 8x to 40x magnification, and this microscope has many accessories to choose from for more functions.
Optional accessories:
1. Digital displacement measuring instrument: 100mm/200mm
The measuring instrument can achieve high-precision positioning of the crystal frustum in the direction perpendicular to the cutting direction, and one of its main purposes is to accurately draw the grid.
2. Camera adaptation upgrade kit
The upgrade kit for CCD cameras includes corresponding microscope components. In addition, a camera, monitor, or computer with image processing software is also required. Customers can choose custom solutions or use cameras, computers, and software provided by OEG.
3. Color video system
This option includes a 1.3 megapixel color camera, an all-in-one computer, and image processing software that can display camera images on the screen and support image saving.
4. Line width measurement
This extended image processing software can achieve high-precision line width measurement with sub-pixel resolution.
Precise cutting, easy to operate:
After fixing the substrate on the chuck, align the microscope with the wafer. By manually driving the worktable to move along the X and Y axes, the marking can be adjusted to the reference mark or structure on the sample. High quality zoom microscopes can quickly switch between viewing probability maps and detail maps of samples. By fine-tuning on the X/Y workbench, the wafer can be accurately positioned. The contact point of the marking diamond can be adjusted through the eyepiece or the crosshair on the display screen, and the lifting can be controlled by the foot switch. Both hands can operate the marking movement simultaneously. After determining the marking position, use the foot switch to lower the diamond and manually move the chuck to complete the marking.
Similar Product Recommend
