Metallographic sandpaper

FEMA brand wet dry dual-use silicon carbideMetallographic sandpaperSelect silicon carbide abrasive to ensure excellent grinding efficiency; Grade control of abrasives to ensure uniform deformation layer and consistent scratches after grinding; Simultaneously using imported waterproof latex paper to ensureMetallographic sandpaperIt has anti warping, is not easy to wrinkle or break, and is durable. The grade and corresponding abrasive particle size are as follows:

*Acceptable size and granularity customization

GB/T stands for Chinese National Standard GB/T 9258-2000

FEPA stands for European Abrasive Manufacturers Alliance

ANSI stands for American National Standards Institute

Metallographic sandpaperSelection Guide

Different grinding machines require different sizes of sandpaper, and different samples require different grinding processes. A brief introduction to the FEMA sandpaper system is as follows:

CS series sandpaper

Non adhesive economic sandpaper.

AS series sandpaper

Adhesive backed sandpaper is suitable for scenarios that require high flatness of sandpaper or require quick or repeated replacement of sandpaper, such as using adhesive backed disks.

DS series diamond grinding disc

The back iron disc resin diamond grinding disc is suitable for samples with high requirements for flatness and high hardness.

1、 Core Features and Technological Advantages

1. Electrostatic sand planting process

• Uniform distribution of abrasive particlesUsing electrostatic sand planting technology, silicon carbide (SiC) or aluminum oxide (Al ₂ O3) abrasives are vertically oriented and arranged, resulting in high consistency of the grinding surface, reducing scratch depth, and significantly reducing the deformation layer of the sample.

• Optimization of water resistanceThe substrate is high-strength waterproof paper or polyester film, supporting water-cooled grinding to avoid tissue phase transition caused by sample overheating, especially suitable for soft metals such as copper and aluminum.

2. Abrasive system and particle size coverage

• Silicon carbide sandpaperHigh hardness (Mohs 9.5 grade), suitable for materials such as steel and hard alloys.

• Aluminum oxide sandpaperGood toughness, suitable for medium to low hardness materials such as copper alloys and polymers.

• Abrasive type：

• Full granularity coverage：

  process	Particle size range
  Rough grinding (pre grinding)	P80、P120、P180、P240、P320
  fine grinding	P600、P800、P1000、P1200、P1500
  Ultra precision grinding	P2000、P2500、P4000

3. Adhesive design and quick change compatibility

• Adhesive typeDivided into non adhesive (economical), self-adhesive adhesive (PSA), transparent PET adhesive, and iron disk magnetic adhesive, suitable for different equipment needs.

• Quick change system supportMagnetic backing sandpaper (such as Magic series) can be paired with the magnetic disc of FEMA polishing machine (FMTP series) to achieve sandpaper replacement within 10 seconds and improve laboratory efficiency.

2、 Product series and specifications

FEMA metallographic sandpaper is divided into four series according to applicable equipment size and backing technology, as shown in Table 1:
Table 1: FEMA Metallographic Sandpaper Product Matrix

Particle size specification example (using 200mm sandpaper as an example)：

3、 Application scenarios and selection suggestions

1. Typical Material Adaptation Scheme

• Hard materials (steel, quenched parts)：
  rough grindingSilicon carbide sandpaper P80 → P320 (such as CS8-80F), with high grinding force to quickly level the surface.
  fine grindingAluminum oxide sandpaper P1200 → P2500 (such as AS8-1200FF) to reduce deep scratches.

• Soft metals (copper, aluminum)：
  Fully water-cooled throughout the processUse P400 or higher fine-grained sandpaper, with a single grinding time of ≤ 2 minutes, to avoid abrasive particle embedding (case: copper sample preparation requires frequent cleaning to prevent particle embedding).

• Porous/brittle materials (ceramics, coatings)：
  Ultra precision grindingDiamond composite sandpaper DS series (such as DS8-200E), low-pressure grinding to protect edge integrity.

2. Equipment compatibility

• Automatic grinding and polishing machinePriority should be given to the magnetic adhesive DSP series or DS series, which are compatible with the FEMA automatic grinding and polishing machine (such as YMPZ-2-300 model) with stepless speed regulation (100-1000 rpm) and pressure control system.

• manual equipmentEconomical CS series adhesive free sandpaper, equipped with a water spray device to prevent dust.

4、 Market competitive advantage

1. Domestic substitution cost-effectiveness

• The price is 30-50% lower than imported brands such as Struers from Germany and Buehler from the United States, and the performance is similar (such as P4000 sandpaper with Ra ≤ 0.1 μ m after grinding).

2. Scenario based innovation

• Special sandpaper for porous samplesElastic abrasive layer design to prevent pore edge cracking (applied to nickel mesh coating detection).

• Quick change system integrationReduce manual operation time by 70% and improve batch sample consistency.

3. Technical Support System

• Provide process guidance (such as ductile iron P320 → P1500 four pass grinding method) and laboratory planning services.

summary

Fermat's metallographic sandpaperElectrostatic sand planting processEnsure grinding accuracyFull grain size+multi adhesive designCovering diverse scenarios and utilizingQuick change systemandAutomatic equipment compatibilityImprove sample preparation efficiency. Its core advantages lie in:

• Global adaptation of hard and soft materialsThe complete chain from rough grinding of steel (P80) to fine grinding of coating (P4000);

• Domestic high cost-effectivenessBenchmarking against imported performance, significantly reducing costs;

• Technical Support SystemSupporting process solutions to address user selection and operational pain points.
  This product line can meet the precision sampling needs of automotive components (fasteners), new energy (battery cell shells), electronics (FPC circuit boards) and other fields.